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TLV751 Datasheet(PDF) 28 Page - Texas Instruments |
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TLV751 Datasheet(HTML) 28 Page - Texas Instruments |
28 / 31 page www.ti.com PACKAGE OUTLINE C 2.1 1.9 2.1 1.9 0.8 0.7 0.05 0.00 2X 1.6 8X 0.4 10X 0.4 0.2 10X 0.25 0.15 1.5 0.1 0.9 0.1 (0.2) TYP WSON - 0.8 mm max height DSQ0010A PLASTIC SMALL OUTLINE - NO LEAD 4218906/A 04/2019 0.08 C 0.1 C A B 0.05 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. PIN 1 INDEX AREA SEATING PLANE PIN 1 ID SYMM EXPOSED THERMAL PAD SYMM 1 5 6 10 11 SCALE 5.000 A B |
Similar Part No. - TLV751_V01 |
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Similar Description - TLV751_V01 |
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