244

www .littelfuse .com

TVS Diode Arrays

Electronic Protection Array for ESD and Overvoltage Protection

SP723

Dual-In-Line Plastic Packages (PDIP)

8 LEAD DUAL-IN-LINE PLASTIC PACKAGE

C

L

E

C

-B-

E1

INDEX

1 2 3

N/2

N

AREA

SEATING

BASE

PLANE

PLANE

-C-

D1

B1

B

e

D

D1

A

A2

L

-A-

0.010 (0.25)

C

A

M

BS

NOTES:

1. Controlling Dimensions: INCH. In case of conflict between

English and Metric dimensions, the inch dimensions control.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Symbols are defined in the “MO Series Symbol List” in Section

2.2 of Publication No. 95.

4. Dimensions A, A1 and L are measured with the package seated

in JEDEC seating plane gauge GS-3.

5. D, D1, and E1 dimensions do not include mold flash or protru-

sions. Mold flash or protrusions shall not exceed 0.010 inch

(0.25mm).

6. E and

are measured with the leads constrained to be per-

pendicular to datum

.

8. B1 maximum dimensions do not include dambar protrusions.

Dambar protrusions shall not exceed 0.010 inch (0.25mm).

9. N is the maximum number of terminal positions.

10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,

E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch

(0.76 - 1.14mm).

-C-

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

A

-

0.210

-

5.33

4

A1

0.015

-

0.39

-

4

A2

0.115

0.195

2.93

4.95

-

B

0.014

0.022

0.356

0.558

-

B1

0.045

0.070

1.15

1.77

8, 10

C

0.008

0.014

0.204

0.355

-

D

0.355

0.400

9.01

10.16

5

D1

0.005

-

0.13

-

5

E

0.300

0.325

7.62

8.25

6

E1

0.240

0.280

6.10

7.11

5

e

0.100 BSC

2.54 BSC

-

0.300 BSC

7.62 BSC

6

-

0.430

-

10.92

7

L

0.115

0.150

2.93

3.81

4

N8

8

9