6

Specifications HCTS283MS

TABLE 6. APPLICABLE SUBGROUPS

CONFORMANCE GROUPS

METHOD

GROUP A SUBGROUPS

READ AND RECORD

Initial Test (Preburn-In)

100%/5004

1, 7, 9

ICC, IOL/H

Interim Test I (Postburn-In)

100%/5004

1, 7, 9

ICC, IOL/H

Interim Test II (Postburn-In)

100%/5004

1, 7, 9

ICC, IOL/H

PDA

100%/5004

1, 7, 9, Deltas

Interim Test III (Postburn-In)

100%/5004

1, 7, 9

ICC, IOL/H

PDA

100%/5004

1, 7, 9, Deltas

Final Test

100%/5004

2, 3, 8A, 8B, 10, 11

Group A (Note 1)

Sample/5005

1, 2, 3, 7, 8A, 8B, 9, 10, 11

Group B

Subgroup B-5

Sample/5005

1, 2, 3, 7, 8A, 8B, 9, 10, 11, Deltas

Subgroups 1, 2, 3, 9, 10, 11,

(Note 2)

Subgroup B-6

Sample/5005

1, 7, 9

Group D

Sample/5005

1, 7, 9

NOTES:

1. Alternate Group A, in accordance with Method 5005 of MIL-STD-883, may be exercised.

2. Table 5 parameters only.

TABLE 7. TOTAL DOSE IRRADIATION

CONFORMANCE

GROUPS

METHOD

TEST

READ AND RECORD

PRE RAD

POST RAD

PRE RAD

POST RAD

Group E Subgroup 2

5005

1, 7, 9

Table 4

1, 9

Table 4 (Note 1)

NOTE: 1. Except FN Test which will be performed 100% Go/No-Go.

TABLE 8. STATIC BURN-IN AND DYNAMIC

OPEN

GROUND

1/2 VCC = 3V

± 0.5V

VCC = 6V

± 0.5V

OSCILLATOR

50kHz

25kHz

STATIC BURN-IN I TEST CONNECTIONS (Note 1)

1, 4, 9, 10, 13

2, 3, 5, 6, 7, 8, 11,

12, 14, 15

-16

-

-

STATIC BURN-IN II TEST CONNECTIONS (Note 1)

1, 4, 9, 10, 13

8

-

2, 3, 5, 6, 7, 11, 12,

14, 15, 16

--

DYNAMIC BURN-IN TEST CONNECTIONS (Note 2)

-

8

1, 4, 9, 10, 13

16

2, 6, 7, 11, 15

3, 5, 12, 14

NOTES:

1. Each pin except VCC and GND will have a resistor of 10k

Ω ± 5% for static burn-in

2. Each pin except VCC and GND will have a resistor of 1K

Ω ± 5% for dynamic burn-in

TABLE 9. IRRADIATION TEST CONNECTIONS

OPEN

GROUND

VCC = 5V

± 0.5V

1, 4, 9, 10, 13

8

2, 3, 5, 6, 7, 11, 12, 14, 15, 16

NOTE: Each pin except VCC and GND will have a resistor of 47K

Ω ± 5% for irradiation testing.

Group E, Subgroup 2, sample size is 4 dice/wafer 0 failures.

Spec Number

518641