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FMA219 Datasheet(PDF) 3 Page - Filtronic Compound Semiconductors |
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FMA219 Datasheet(HTML) 3 Page - Filtronic Compound Semiconductors |
3 / 5 page PRELIMINARY FMA219 X-BAND LNA MMIC Phone: +1 408 850-5790 http://www.filtronic.co.uk/semis Revised: 11/22/04 Fax: +1 408 850-5766 Email: sales@filcsi.com • ASSEMBLY DRAWING Notes: • Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter wire. The bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is recommended. Ultrasonic or thermosonic bonding is not recommended. • The recommended die attach is conductive epoxy, following the manufacturer’s recommended curing procedure. • For eutectic die attach the maximum time at 280-300°C is 60 seconds, and should be kept to a minium. • The supply de-coupling capacitor (150 pF recommended value) should be placed as close to the MMIC as practical. All information and specifications subject to change without notice. 75 µm nominal gap on each side 250 µm Au ribbon recommended 25 µm dia. Au wire (x2) on input and output ports, less than 1000 µm length each To +VDD Input and output thin film substrates with 50 Ω microstrip transmission lines. Substrate thickness 250 µm or thinner is recommended. 150pF capacitor |
Similar Part No. - FMA219 |
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Similar Description - FMA219 |
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