12
Coverage :
95% each termination.
Visual : No crack of termination parts and
ceramic exposure of surface by melting
After immersing in flux. dip into the 235
±5℃ molten
solder for 2
±0.5 sec
Solder : S63A(KSD 6704)
Flux : ROSIN(KSM 2951)
Flux is the composition of ROSIN and the methanol Weight
rate of ROSIN is about 25%
Solderability
Bending Test
△R :
±(0.5%+0.05Ω) of the initial value
Visual : No evidence of mechanical damage.
After soldering resistor on the
PCB, 3mm of bending shall
be applied for 10 sec.
Material of PCB : Glass Epoxy
Thickness : 1.6mm
Measure resistance during load application
Terminal Strenght
Load pull :
0.5kg
1005(1/16W), 1608(1/16W) 0.3kg
pull Direction fixed 0.4 lead
Terminal Strenght
△R :
±(1%+0.05Ω) of the initial value
Visual : No evidence of mechanical damage.
Anti-Vibration Test
△R :
±(1%+0.05Ω) of the initial value
Visual : No evidence of mechanical damage.
Immerse in molten solder at 260
±5℃ for 10±1 sec.
Preheat and soldering Procedure
2 hours each in X, Y, and Z axis(toyal 6 hours) 10 to
55 Hz sweep in 1 minute ampiltude.
Item
Specification
Test Method
CHARACTERISTICS PERFORMANCE
ELECTRICAL CHARACTERISTICS
MECHANICAL CHARACTERISTICS
T
TH
HIIC
CK
K F
FIIL
LM
M C
CH
HIIP
P R
RE
ES
SIIS
ST
TO
OR
RS
S
Direct Current
Resistance
Within the regulated resistance tolerance.
Jumper chip
50
㏁
1 R 10:+300ppm/
℃
-200ppm/
℃
10 R 1M:
±100ppm/℃
1M R 10M:
±300ppm/℃
△R :
±(1%+0.1Ω) of the initial value
Visual : No evidence of mechanical damage
Jumper chip :
50
㏁
Apply 2.5 times rated voltage for 5sec.
Wait 30 minutes at room temperature and measure the
resistance value.
△R :
±(3%+0.1Ω) of the initial value
Visual : No evidence of mechanical damage
Jumper chip :
50
㏁
No evidence of mechanical damage.
Apply AC 500V for 1 minute.
1005(1/16W), 1608(1/16W):Apply AC 100V for 1 minute
Over the 1000
㏁
Apply DC 500V for 1 minute.
1005(1/16W), 1608(1/16W):Apply DC 100V for 1 minute
Perform 10,000 cycles at 2.5 times RCW or the Max.
over load voltage
ON(2.5 times rated volage) : 1 sec
OFF
: 25 sec
Have stabilization time of 30 minutes without loading
and measure resistance.
Test temperature(
℃) (20) → (-55) → (20) → (125) → (20)
T.C.R(ppm/
℃) = (R-Ro)/Ro×1/(T-To) ×106
T = 20(
℃)
T = Test temperature(
℃)
Ro = Resistance at room temperature(
Ω)
R = Resistance at T(
Ω)
Applying time:within 5 sec
T.C.R(Resistance
Temperature
Characteristic)
Short-time Overload
Intermittent
Overload
Dielectric withstand-
ing Voltage
Insulation Resistance
Item
Specification
Test Method
Resistance range(
Ω)
R
100
100
R 1K
1K R 10K
10K R 100K
100K R 1M
1M R
Max test voltage(V)
0.3
1.0
3
10
25
50
Solder : S63A(SSD 6704)
Flux : The composition of ROSIN
(KSM295)25% and methanol
(KSM 1658)75%
Temperature(
℃)
Time(sec)
80 - 100
150 - 180
260 + 5
150 - 180
80 - 100
120
120
10
60
60
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