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OPA861ID Datasheet(PDF) 2 Page - Texas Instruments |
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OPA861ID Datasheet(HTML) 2 Page - Texas Instruments |
2 / 28 page www.ti.com ABSOLUTE MAXIMUM RATINGS (1) 1 2 3 4 8 7 6 5 I Q Adjust E B V − = −5V C V+ = +5V NC NC SO−8 Top View 1 2 3 6 5 4 I Q Adjust −V S B +V S C E SOT23−6 OPA861 SBOS338 – AUGUST 2005 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) SPECIFIED PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT MEDIA, PRODUCT PACKAGE DESIGNATOR RANGE MARKING NUMBER QUANTITY OPA861ID Rails, 75 OPA861 SO-8 D –45 °C to +85°C OPA861 OPA861IDR Tape and Reel, 2500 OPA861IDBVT Tape and Reel, 250 OPA861 SOT23-6 DBV –45 °C to +85°C N5R OPA861IDBVR Tape and Reel, 3000 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Power Supply ±6.5V DC Internal Power Dissipation See Thermal Information Differential Input Voltage ±1.2V Input Common-Mode Voltage Range ±V S Storage Temperature Range: D –40 °C to +125°C Lead Temperature (soldering, 10s) +260 °C Junction Temperature (TJ) +150°C ESD Rating: Human Body Model (HBM)(2) 1500V Charge Device Model (CDM) 1000V (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operations of the device at these and any other conditions beyond those specified is not supported. (2) Pin 2 for the SO-8 package > 500V HBM. Pin 4 for the SOT23-6 package > 500V HBM. PIN CONFIGURATION 2 |
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