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AS7C251MPFD18A-133TQIN Datasheet(PDF) 4 Page - Alliance Semiconductor Corporation

Part # AS7C251MPFD18A-133TQIN
Description  2.5V 1M x 18 pipelined burst synchronous SRAM
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Manufacturer  ALSC [Alliance Semiconductor Corporation]
Direct Link  https://www.alliancememory.com
Logo ALSC - Alliance Semiconductor Corporation

AS7C251MPFD18A-133TQIN Datasheet(HTML) 4 Page - Alliance Semiconductor Corporation

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®
AS7C251MPFD18A
2/10/05, v. 1.2
Alliance Semiconductor
4 of 19
Functional description
The AS7C251MPFD18A is a high-performance CMOS 16-Mbit synchronous Static Random Access Memory (SRAM) device organized as
1,048,576 words X 18 bits and incorporates a two-stage register-register pipeline for highest frequency on any given technology.
Fast cycle times of 6/7.5 ns with clock access times (tCD) of 3.5/3.8 ns enable 166 MHz and 133 MHz bus frequencies. Three chip enable
(CE) inputs permit easy memory expansion. Burst operation is initiated in one of two ways: the controller address strobe (ADSC), or the
processor address strobe (ADSP). The burst advance pin (ADV) allows subsequent internally generated burst addresses.
Read cycles are initiated with ADSP (regardless of WE and ADSC) using the new external address clocked into the on-chip address register
when ADSP is sampled LOW, the chip enables are sampled active, and the output buffer is enabled with OE. In a read operation, the data
accessed by the current address registered in the address registers by the positive edge of CLK is carried to the data-out registers and driven
on the output pins on the next positive edge of CLK. ADV is ignored on the clock edge that samples ADSP asserted, but it is sampled on all
subsequent clock edges. Address is incremented internally for the next access of the burst when ADV is sampled LOW and both address
strobes are HIGH. Burst mode is selectable with the LBO input. With LBO unconnected or driven HIGH, burst operations use an interleaved
count sequence. With LBO driven LOW, the device uses a linear count sequence.
Write cycles are performed by disabling the output buffers with OE and asserting a write command. A global write enable GWE writes all
18 bits regardless of the state of individual BW[a,b] inputs. Alternately, when GWE is HIGH, one or more bytes may be written by asserting
BWE and the appropriate individual byte BWn signals.
BWn is ignored on the clock edge that samples ADSP LOW, but it is sampled on all subsequent clock edges. Output buffers are disabled
when BWn is sampled LOW, regardless of OE. Data is clocked into the data input register when BWn is sampled LOW. Address is
incremented internally to the next burst address if BWn and ADV are sampled LOW. This device operates in double-cycle deselect feature
during read cycles.
Read or write cycles may also be initiated with ADSC instead of ADSP. The differences between cycles initiated with ADSC and ADSP are
as follows:
•ADSP must be sampled HIGH when ADSC is sampled LOW to initiate a cycle with ADSC.
•WE signals are sampled on the clock edge that samples ADSC LOW (and ADSP HIGH).
Master chip enable CE0 blocks ADSP, but not ADSC.
The AS7C251MPFD18A family
operates with a 2.5V ± 5% power supply for the device core (VDD). These devices are available in a 100-
pin TQFP package.
TQFP capacitance
* Guaranteed not tested
TQFP thermal resistance
Parameter
Symbol
Test conditions
Min
Max
Unit
Input capacitance
CIN*
VIN = 0V
-
5
pF
I/O capacitance
CI/O*
VOUT = 0V
-
7
pF
Description
Conditions
Symbol
Typical
Units
Thermal resistance
(junction to ambient)1
1 This parameter is sampled
Test conditions follow standard test methods
and procedures for measuring thermal
impedance, per EIA/JESD51
1–layer
θJA
40
°C/W
4–layer
θJA
22
°C/W
Thermal resistance
(junction to top of case)1
θJC
8
°C/W


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