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AS7C1025B-12JC Datasheet(PDF) 2 Page - Alliance Semiconductor Corporation

Part # AS7C1025B-12JC
Description  5V 128K X 8 CMOS SRAM (Center power and ground)
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Manufacturer  ALSC [Alliance Semiconductor Corporation]
Direct Link  https://www.alliancememory.com
Logo ALSC - Alliance Semiconductor Corporation

AS7C1025B-12JC Datasheet(HTML) 2 Page - Alliance Semiconductor Corporation

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AS7C1025B
3/26/04, v. 1.3
Alliance Semiconductor
P. 2 of 9
®
Functional description
The AS7C1025B is a high-performance CMOS 1,048,576-bit Static Random Access Memory (SRAM) devices organized as 131,072 x 8
bits. They are designed for memory applications where fast data access, low power, and simple interfacing are desired.
Equal address access and cycle times (tAA, tRC, tWC) of 10/12/15/20 ns with output enable access times (tOE) of 5/6/7/8 ns are ideal for high-
performance applications. The chip enable input CE permits easy memory and expansion with multiple-bank memory systems.
When CE is high, the device enters standby mode. If inputs are still toggling, the device will consume ISB power. If the bus is static, then full
standby power is reached (ISB1). For example, the AS7C1026B is guaranteed not to exceed 55 mW under nominal full standby conditions.
A write cycle is accomplished by asserting write enable (WE) and chip enable (CE). Data on the input pins I/O0 through I/O7 is written on
the rising edge of WE (write cycle 1) or CE (write cycle 2). To avoid bus contention, external devices should drive I/O pins only after
outputs have been disabled with output enable (OE) or write enable (WE).
A read cycle is accomplished by asserting output enable (OE) and chip enable (CE), with write enable (WE) high. The chips drive I/O pins
with the data word referenced by the input address. When either chip enable or output enable is inactive or write enable is active, output
drivers stay in high-impedance mode.
All chip inputs and outputs are TTL-compatible, and operation is from a single 5 V supply. The AS7C1025B is packaged in common
industry standard packages.
NOTE: Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and func-
tional operation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure
to absolute maximum rating conditions for extended periods may affect reliability.
Key: X = don’t care, L = low, H = high.
Absolute maximum ratings
Parameter
Symbol
Min
Max
Unit
Voltage on VCC relative to GND
Vt1
–0.50
+7.0
V
Voltage on any pin relative to GND
Vt2
–0.50
VCC + 0.5
V
Power dissipation
PD
–1.0
W
Storage temperature (plastic)
Tstg
–65
+150
o C
Ambient temperature with VCC applied
Tbias
–55
+125
o C
DC current into outputs (low)
IOUT
–20
mA
Truth table
CE
WE
OE
Data
Mode
H
X
X
High Z
Standby (ISB, ISB1)
L
H
H
High Z
Output disable (ICC)
LHL
DOUT
Read (ICC)
LL
X
DIN
Write (ICC)


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