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AMC3301-Q1 Datasheet(PDF) 36 Page - Texas Instruments |
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AMC3301-Q1 Datasheet(HTML) 36 Page - Texas Instruments |
36 / 37 page www.ti.com EXAMPLE STENCIL DESIGN 16X (1.65) 16X (0.6) 14X (1.27) (9.75) 16X (2) 16X (0.6) 14X (1.27) (9.3) 4223098/A 07/2016 SOIC - 2.65 mm max height DWE0016A SOIC NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SYMM SYMM 1 8 9 16 HV / ISOLATION OPTION 8.1 mm CLEARANCE/CREEPAGE SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:4X SYMM SYMM 1 8 9 16 IPC-7351 NOMINAL 7.3 mm CLEARANCE/CREEPAGE |
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