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BUF634A Datasheet(PDF) 3 Page - Texas Instruments |
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BUF634A Datasheet(HTML) 3 Page - Texas Instruments |
3 / 41 page 5 Device Comparison Table DEVICE VS ± (V) IQ / CHANNEL (mA) BW (MHz) SLEW RATE (V/µs) VOLTAGE NOISE (nV/√ Hz) AMPLIFIER DESCRIPTION BUF634A ±18 1.5 – 8.5 35 – 210 3750 3.4 Unity-gain, open-loop buffer BUF634 ±18 1.5 – 15 30 – 180 2000 4 Unity-gain, open-loop buffer LMH6321 ±18 11 110 1800 2.8 Unity-gain, open-loop buffer with adjustable current limit 6 Pin Configuration and Functions BW NC V IN V– NC V+ V O NC 1 2 3 4 8 7 6 5 G = 1 Figure 6-1. D and DDA Packages 8-Pin SOIC, 8-Pin HSOIC with Thermal Pad Top View BW NC VIN 9¤ 1 2 3 4 NC V+ VO NC 8 7 6 5 Exposed Thermal Die Pad on Underside (1) Figure 6-2. DRB Package (Preview) 8-Pin VSON with Thermal Pad Top View Pin Functions PIN I/O(2) DESCRIPTION NAME DDA(1) DRB(1) D BW 1 1 1 I Bandwidth adjust pin. Connect the BW pin to the V– pin for wide-BW mode and leave the BW pin floating for low-IQ mode. See the Adjustable Bandwidth section. NC 2, 5, 8 2, 5, 8 2, 5, 8 — No internal connection V– 4 4 4 P Negative power supply V+ 7 7 7 P Positive power supply VIN 3 3 3 I Input VO 6 6 6 O Output Thermal Pad — — Thermal pad. Must be electrically shorted to V–. (1) The DRB and DDA packages include a thermal pad on the backside of the device. The thermal pad must be connected to the same potential as V–. Connect the thermal pad and V– to a heat-spreading plane to achieve low thermal impedance. The thermal pad can also be unused (not connected to any heat-spreading plane or voltage), thus giving an overall higher thermal impedance. (2) I = input, O = output, P = power. www.ti.com BUF634A SBOS948D – FEBRUARY 2019 – REVISED SEPTEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: BUF634A |
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