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BUF634A Datasheet(PDF) 4 Page - Texas Instruments |
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BUF634A Datasheet(HTML) 4 Page - Texas Instruments |
4 / 41 page 7 Specifications 7.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted).(1) MIN MAX UNIT VS = (V+) – (V–) Supply voltage 40 (±20) V VIN Input voltage Vs ± 0.5 V Output short-circuit (to ground) Continuous TA Operating ambient temperature –40 125 °C TJ Junction temperature 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±3000 V Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted). MIN NOM MAX UNIT VS = (V+) – (V–) Supply voltage ±2.25 ±15 ±18 V TA Ambient temperature –40 25 125(1) °C (1) Limited by RΘJA and TJ,Max for safe operation. See the Output Current section. 7.4 Thermal Information THERMAL METRIC(1) BUF634A UNIT D (SOIC) DRB (VSON) DDA (HSOIC) 8 PINS 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 122.9 50.5 41.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 55.2 60 57.1 °C/W RθJB Junction-to-board thermal resistance 68.4 23.6 17.0 °C/W ΨJT Junction-to-top characterization parameter 12.1 1.5 4.6 °C/W ΨJB Junction-to-board characterization parameter 67.2 23.6 17.0 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance NA 6.9 5.3 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. BUF634A SBOS948D – FEBRUARY 2019 – REVISED SEPTEMBER 2020 www.ti.com 4 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: BUF634A |
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