ISO6741-Q1 datasheet(6/35 Pages) TI

Part #	ISO6741-Q1

Description	ISO674x-Q1 General-Purpose Quad-Channel Automotive Digital Isolators with Robust EMC

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6.4 Thermal Information

THERMAL METRIC(1)

ISO674x

UNIT

DW (SOIC)

16 PINS

RθJA

Junction-to-ambient thermal resistance

73

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

36.1

°C/W

RθJB

Junction-to-board thermal resistance

40.4

°C/W

ψJT

Junction-to-top characterization parameter

17

°C/W

ψJB

Junction-to-board characterization parameter

39.9

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Power Ratings

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

ISO6741

PD

Maximum power dissipation (both sides)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15

pF, Input a 25-MHz 50% duty cycle

square wave

134.9

mW

PD1

Maximum power dissipation (side-1)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15

pF, Input a 25-MHz 50% duty cycle

square wave

50.8

mW

PD2

Maximum power dissipation (side-2)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15

pF, Input a 25-MHz 50% duty cycle

square wave

84.1

mW

ISO6741-Q1

SLLSFG4 – AUGUST 2020

www.ti.com

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