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TPS7A03 Datasheet(PDF) 21 Page - Texas Instruments |
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TPS7A03 Datasheet(HTML) 21 Page - Texas Instruments |
21 / 43 page 21 TPS7A03 www.ti.com SBVS375B – JULY 2019 – REVISED APRIL 2020 Submit Documentation Feedback Copyright © 2019–2020, Texas Instruments Incorporated Feature Description (continued) The thermal time-constant of the semiconductor die is fairly short, thus the device may cycle on and off when thermal shutdown is reached until power dissipation is reduced. Power dissipation during startup can be high from large VIN – VOUT voltage drops across the device or from high inrush currents charging large output capacitors. Under some conditions, the thermal shutdown protection disables the device before startup completes. For reliable operation, limit the junction temperature to the maximum listed in the Recommended Operating Conditions table. Operation above this maximum temperature causes the device to exceed its operational specifications. Although the internal protection circuitry of the device is designed to protect against thermal overall conditions, this circuitry is not intended to replace proper heat sinking. Continuously running the device into thermal shutdown or above the maximum recommended junction temperature reduces long-term reliability. |
Similar Part No. - TPS7A03_V06 |
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Similar Description - TPS7A03_V06 |
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