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V•I Chip Pre-Regulator Module

P048K048T24AL

Rev. 1.4

Page 11 of 15

PRELIMINARY

NOTES:

1- DIMENSIONS ARE

.

2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:

.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]

3- PRODUCT MARKING ON TOP SURFACE

DXF and PDF files are available on vicorpower.com

inch

mm

30,00

1.181

1,00

0.040

15,00

0.591

18,00

0.709

1,00

0.039

9,00

0.354

1,00

0.039

L

L

C

C

BOTTOM VIEW

SOLDER BALL #A1

(88) X ø

0.020

SEATING PLANE

TOP VIEW (COMPONENT SIDE)

SOLDER BALL

#A1 INDICATOR

SOLDER BALL

0,51

3,8

0.15

15,7

0.62

21,5

0.85

32,0

1.26

1,6

0.06

28,8

1.13

5,9

0.23

16,0

0.63

Figure 17 — PRM BGA mechanical outline; Inboard mounting

1,00

0.039

1,50

0.059

0,50

0.020

0,50

0.020

2,00

0.079

CONNECT TO

INNER LAYERS

DEFINED PADS

SOLDER MASK

0,51

0.020

0,53

0.021

1,00

0.039

9,00

0.354

16,16

0.636

8,08

0.318

20,00

0.787

24,00

0.945

28,00

1.102

10,00

0.394

22,00

0.866

26,00

1.024

30,00

1.181

7,00

0.276

1,00

0.039

18,00

0.709

AND INNER LAYER INTERCONNECT

PCB CUTOUT

AB

CD

31

1

SOLDER PAD #A1

SOLDER MASK

DEFINED PAD

1,6

0.06

0,51

0.020

NOTES:

1- DIMENSIONS ARE

.

2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:

.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]

DXF and PDF files are available on vicorpower.com

inch

mm

RECOMMENDED LAND PATTERN

(COMPONENT SIDE SHOWN)

(2) X

(2) X

(2) X

(2) X

(88) X ø

(4) X R

(4) X

(2) X

(2) X

(2) X

TYP

PLATED VIA

ø

( ø

)

Figure 18 — PRM BGA PCB land / VIA layout information; Inboard mounting

INBOARD MOUNTING

BGA surface mounting requires a cutout in the

PCB in which to recess the V•I Chip

Mechanical Specifications

V•I Chip Pre-Regulator Module