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800-735-6200

V•I Chip Voltage Transformation Module

V048K060T040

Rev. 1.0

Page 7 of 15

PRELIMINARY

NOTES:

1- DIMENSIONS ARE

.

2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:

.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]

3- PRODUCT MARKING ON TOP SURFACE

inch

mm

30,00

1.181

1,00

0.039

15,00

0.591

18,00

0.709

1,00

0.039

9,00

0.354

1,00

0.039

1,00

0.039

L

L

C

C

BOTTOM VIEW

SOLDER BALL #A1

SEATING PLANE

TOP VIEW (COMPONENT SIDE)

SOLDER BALL

#A1 INDICATOR

TYP

3,9

0.15

15,6

0.62

21,5

0.85

32,0

1.26

1,6

0.06

28,8

1.13

5,9

0.23

16,0

0.63

(106) X Ø

0.51

0.020

SOLDER BALL

Mechanical Drawings

Figure 10—V TM BGA mechanical outline; Inboard mounting

NOTES:

1- DIMENSIONS ARE

.

2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:

.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]

inch

mm

15,00

0.591

17,00

0.669

20,00

0.787

13,00

0.512

16,00

0.630

24,00

0.945

8,00

0.315

16,16

0.636

8,08

0.318

18,00

0.709

1,00

0.039

9,00

0.354

0,37

0.015

29,26

1.152

(2) X

0.394

(4) X

0.236

1,00

0.039

PCB CUTOUT

SOLDER PAD #A1

RECOMMENDED LAND AND VIA PATTERN

(COMPONENT SIDE SHOWN)

SOLDER MASK

DEFINED PAD

1,6

0.06

0,51

0.020

1,00

0.039

1,50

0.059

0,50

0.020

1,00

0.039

0,50

0.020

1,00

0.039

SOLDER MASK

DEFINED PADS

CONNECT TO

INNER LAYERS

0,51

0.020

0,53

0.021

10,00

6,00

(106) X ø

(4) X R

( ø

)

(

)

ø

PLATED VIA

(

)

31

1

Figure 11— VTM BGA PCB land/VIA layout information; Inboard mounting

IN-BOARD MOUNTING

BGA surface mounting requires a

cutout in the PCB in which to recess the V•I Chip