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IXGH24N60AU1 Datasheet(PDF) 2 Page - IXYS Corporation

Part # IXGH24N60AU1
Description  HiPerFAST IGBT with Diode
Download  6 Pages
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Manufacturer  IXYS [IXYS Corporation]
Direct Link  http://www.ixys.com
Logo IXYS - IXYS Corporation

IXGH24N60AU1 Datasheet(HTML) 2 Page - IXYS Corporation

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IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents:
4,835,592
4,881,106
5,017,508
5,049,961
5,187,117
5,486,715
4,850,072
4,931,844
5,034,796
5,063,307
5,237,481
5,381,025
IXYS reserves the right to change limits, test conditions, and dimensions.
IXGH24N60AU1
IXGH24N60AU1S
1. Gate
2. Collector
3. Emitter
4. Collector
Dim.
Millimeter
Inches
Min.
Max.
Min.
Max.
A
4.83
5.21
.190
.205
A1
2.29
2.54
.090
.100
A2
1.91
2.16
.075
.085
b
1.14
1.40
.045
.055
b1
1.91
2.13
.075
.084
C
0.61
0.80
.024
.031
D
20.80
21.34
.819
.840
E
15.75
16.13
.620
.635
e
5.45
BSC
.215
BSC
L
4.90
5.10
.193
.201
L1
2.70
2.90
.106
.114
L2
2.10
2.30
.083
.091
L3
0.00
0.10
.00
.004
L4
1.90
2.10
.075
.083
ØP
3.55
3.65
.140
.144
Q
5.59
6.20
.220
.244
R
4.32
4.83
.170
.190
S
6.15
BSC
.242
BSC
TO-247 SMD Outline
TO-247 AD Outline
Dim.
Millimeter
Inches
Min.
Max.
Min.
Max.
A
4.7
5.3
.185
.209
A
1
2.2
2.54
.087
.102
A
2
2.2
2.6
.059
.098
b
1.0
1.4
.040
.055
b
1
1.65
2.13
.065
.084
b
2
2.87
3.12
.113
.123
C
.4
.8
.016
.031
D
20.80
21.46
.819
.845
E
15.75
16.26
.610
.640
e
5.20
5.72
0.205 0.225
L
19.81
20.32
.780
.800
L1
4.50
.177
∅P
3.55
3.65
.140
.144
Q
5.89
6.40
0.232 0.252
R
4.32
5.49
.170
.216
S
6.15 BSC
242 BSC
e
∅ P
Symbol
Test Conditions
Characteristic Values
(T
J = 25°C, unless otherwise specified)
min.
typ.
max.
g
fs
I
C
= I
C90; VCE = 10 V,
9
13
S
Pulse test, t
≤ 300 µs, duty cycle ≤ 2 %
C
ies
1500
pF
C
oes
V
CE = 25 V, VGE = 0 V, f = 1 MHz
175
pF
C
res
40
pF
Q
g
90
120
nC
Q
ge
I
C = IC90, VGE = 15 V, VCE = 0.5 VCES
11
15
nC
Q
gc
30
40
nC
t
d(on)
25
ns
t
ri
15
ns
E
on
0.6
mJ
t
d(off)
150
200
ns
t
fi
110
270
ns
E
off
1.5
mJ
t
d(on)
25
ns
t
ri
15
ns
E
on
0.8
mJ
t
d(off)
250
ns
t
fi
400
ns
E
off
2.3
mJ
R
thJC
0.83 K/W
R
thCK
0.25
K/W
Inductive load, T
J = 125°
°°°°C
I
C = IC90, VGE = 15 V, L = 100 µH
V
CE = 0.8 VCES, RG = Roff = 10 Ω
Remarks: Switching times may increase
for V
CE (Clamp) > 0.8 • VCES, higher TJ or
increased R
G
Inductive load, T
J = 25°
°°°°C
I
C = IC90, VGE = 15 V, L = 100 µH,
V
CE = 0.8 VCES, RG = Roff = 10 Ω
Remarks: Switching times may increase
for V
CE (Clamp) > 0.8 • VCES, higher TJ or
increased R
G
Min. Recommended Footprint
(Dimensions in inches and (mm))
Reverse Diode (FRED)
Characteristic Values
(T
J = 25°C, unless otherwise specified)
Symbol
Test Conditions
min.
typ.
max.
V
F
I
F = IC90, VGE = 0 V,
1.6
V
Pulse test, t
≤ 300 µs, duty cycle d ≤ 2 %
I
RM
I
F = IC90 , VGE = 0 V, -diF/dt = 240 A/µs10
15
A
t
rr
V
R = 360 V
T
J =
125
°C 150
ns
I
F = 1 A; -di/dt = 100 A/µs; VR = 30 V TJ =
25
°C35
50
ns
R
thJC
1 K/W


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