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PE310G4DE4816BIA Datasheet(HTML) 4 Page - Silicom Ltd. |
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PE310G4DE4816BIA Datasheet(HTML) 4 Page - Silicom Ltd. |
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Silicom Ltd. Connectivity Solutions Page 4 Monitoring of Broadwell-DE SoC power state and thermal status Micro-BMC Low cost design based on the NXP LPC1768 microcontroller Access provided through a NC-SI interface to the 1Gb Ethernet controller Serial BMC and Intel console ports for debug (accessible through USB2.0 interface utilizing a 5-pin header on board as well as remotely through an IPMI client “serial over LAN console”) Slave SMBus interface for access from the PCIe card interface Remote Thermal Monitor and Fan Controller (On Semi NCT7491 or equivalent) PECI 3.0 Interface compatible On−chip Temperature Sensor Peripheral Interfaces 3 USB 3.0 ports One accessible through the front faceplate (Type-A right angle connector) Two located on PCB toward the rear (Type-A vertical connectors) Debug Interfaces 2 Extended Debug Ports (XDP) One for the CPU cores side of the Broadwell-DE SoC One for the PCH side of the Broadwell-DE SoC Samtec 60 pin BSH-030-01 series connector for each (not populated in production) 2 virtual serial ports via a USB2.0 Interface One serial port for Micro-BMC console and programming One serial port for an Intel console interface sourced from the Broadwell-DE SoC (this console port can also be connected to the Micro-BMC to be accessed across the Ethernet management port as selected through a jumper ) Micro-B USB right angle connector located along the top board edge Power 55W typical (75% utilization), 73W Thermal Design Power (max), 173W Peak 12VDC through a 6 pin connector (Molex 45558-0003 or equivalent) located on rear edge of board Form Factor PCI Express Add-in Card, standard height, full length Dimensions 9.84” x 4.2”, 250mm x 106.7mm |
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