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LT8331 Datasheet(HTML) 28 Page - Analog Devices

Part No. LT8331
Description  Low IQ Boost/SEPIC/Flyback/Inverting Converter with 0.5A, 140V Switch
Download  30 Pages
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Maker  AD [Analog Devices]
Homepage  http://www.analog.com
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LT8331 Datasheet(HTML) 28 Page - Analog Devices

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LT8331
28
Rev. C
For more information www.analog.com
PACKAGE DESCRIPTION
MSOP (MSE16(12)) 0213 REV D
0.53
±0.152
(.021
±.006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 –0.27
(.007 – .011)
TYP
0.86
(.034)
REF
0.50
(.0197)
BSC
1.0
(.039)
BSC
1.0
(.039)
BSC
16
16 14 121110
1
3 5 6 7 8
9
9
1
8
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL
NOT EXCEED 0.254mm (.010") PER SIDE.
0.254
(.010)
0
° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.10
(.201)
MIN
3.20 – 3.45
(.126 – .136)
0.889
±0.127
(.035
±.005)
RECOMMENDED SOLDER PAD LAYOUT
0.305
±0.038
(.0120
±.0015)
TYP
0.50
(.0197)
BSC
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.845
±0.102
(.112
±.004)
2.845
±0.102
(.112
±.004)
4.039
±0.102
(.159
±.004)
(NOTE 3)
1.651
±0.102
(.065
±.004)
1.651
±0.102
(.065
±.004)
0.1016
±0.0508
(.004
±.002)
3.00
±0.102
(.118
±.004)
(NOTE 4)
0.280
±0.076
(.011
±.003)
REF
4.90
±0.152
(.193
±.006)
DETAIL “B”
DETAIL “B”
CORNER TAIL IS PART OF
THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
0.12 REF
0.35
REF
MSE Package
Variation: MSE16 (12)
16-Lead Plastic MSOP with 4 Pins Removed
Exposed Die Pad
(Reference LTC DWG # 05-08-1871 Rev D)


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