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LT8331 Datasheet(HTML) 28 Page - Analog Devices |
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LT8331 Datasheet(HTML) 28 Page - Analog Devices |
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LT8331 28 Rev. C For more information www.analog.com PACKAGE DESCRIPTION MSOP (MSE16(12)) 0213 REV D 0.53 ±0.152 (.021 ±.006) SEATING PLANE 0.18 (.007) 1.10 (.043) MAX 0.17 –0.27 (.007 – .011) TYP 0.86 (.034) REF 0.50 (.0197) BSC 1.0 (.039) BSC 1.0 (.039) BSC 16 16 14 121110 1 3 5 6 7 8 9 9 1 8 NOTE: 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL NOT EXCEED 0.254mm (.010") PER SIDE. 0.254 (.010) 0 ° – 6° TYP DETAIL “A” DETAIL “A” GAUGE PLANE 5.10 (.201) MIN 3.20 – 3.45 (.126 – .136) 0.889 ±0.127 (.035 ±.005) RECOMMENDED SOLDER PAD LAYOUT 0.305 ±0.038 (.0120 ±.0015) TYP 0.50 (.0197) BSC BOTTOM VIEW OF EXPOSED PAD OPTION 2.845 ±0.102 (.112 ±.004) 2.845 ±0.102 (.112 ±.004) 4.039 ±0.102 (.159 ±.004) (NOTE 3) 1.651 ±0.102 (.065 ±.004) 1.651 ±0.102 (.065 ±.004) 0.1016 ±0.0508 (.004 ±.002) 3.00 ±0.102 (.118 ±.004) (NOTE 4) 0.280 ±0.076 (.011 ±.003) REF 4.90 ±0.152 (.193 ±.006) DETAIL “B” DETAIL “B” CORNER TAIL IS PART OF THE LEADFRAME FEATURE. FOR REFERENCE ONLY NO MEASUREMENT PURPOSE 0.12 REF 0.35 REF MSE Package Variation: MSE16 (12) 16-Lead Plastic MSOP with 4 Pins Removed Exposed Die Pad (Reference LTC DWG # 05-08-1871 Rev D) |
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