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LM27241MTCX Datasheet(PDF) 7 Page - National Semiconductor (TI) |
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LM27241MTCX Datasheet(HTML) 7 Page - National Semiconductor (TI) |
7 / 27 page Electrical Characteristics (Continued) Specifications with standard typeface are for T J = 25˚C, and those with boldface apply over full Operating Junction Tempera- ture range. VDD = V5 = 5V, V SGND =VPGND = 0V, VIN = 15V, VEN = 3V, RFADJ = 22.1K unless otherwise stated (Note 5). Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis. Symbol Parameter Conditions Min Typical (Note 7) Max Units I ILIM ILIM Pin Current (sourcing) V ILIM =0V 46 62 76 µA V ILIM_TH I ILIM Threshold Voltage -10 0 10 mV V SW_ZERO Zero-cross Threshold (SW Pin) LDRV goes low -2.2 mV Oscillator F OSC PWM Frequency R FADJ = 22.1k Ω 255 300 345 kHz R FADJ = 12.4k Ω 500 R FADJ = 30.9k Ω 200 V RAMP PWM Ramp Peak-to-peak Amplitude VIN = 15V 1.6 V VIN = 24V 2.95 V VALLEY PWM Ramp Valley 0.8 V ∆F OSC_VIN Frequency Change with VIN VIN = 5.5V to 24V ±1% ∆F OSC_VDD Frequency Change with VDD VDD = 4.5V to 5.5V ±2% V FREQ_VIN FREQ Pin Voltage vs. VIN 0.105 V/V System t ON_MIN Minimum ON Time V FPWM =3V 30 ns D MAX Maximum Duty Cycle VIN = 5.5V 60 75 % VIN = 15V 40 50 % VIN = 28V, VDD= 4.5V 22 28 % Gate Drivers R HDRV_SOURCE HDRV Source Impedance HDRV Pin Current (sourcing)= 1.2A 7 Ω R HDRV_SINK HDRV Sink Impedance HDRV Pin Current (sinking) =1A 2 Ω R LDRV_SOURCE LDRV Source Impedance LDRV Pin Current (sourcing) = 1.2A 7 Ω R LDRV_SINK LDRV Sink Impedance LDRV Pin Current (sinking) =2A 1 Ω t DEAD Cross-conduction Protection Delay (deadtime) HDRV Falling to LDRV Rising 40 ns LDRV Falling to HDRV Rising 70 Note 1: Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is guaranteed. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics table. Note 2: PGND and SGND are all electrically connected together on the PCB. Note 3: The maximum allowable power dissipation is calculated by using PDmax =(TJMAX -TA)/θJA , where TJMAX is the maximum junction temperature, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance of the specified package. The 0.75W rating of the TSSOP-20 package for example results from using 125˚C, 25˚C, and 118˚C/W for TJMAX,TA, and θJA respectively. The rated power dissipation should be derated by 10mW/˚C above 25˚C ambient for the TSSOP package. The θJA value above represents the worst-case condition with no heat sinking. Heat sinking will permit more power to be dissipated at higher ambient temperatures. For detailed information on soldering plastic TSSOP package, refer to http://www.national.com/packaging/. Note 4: ESD is applied by the human body model, which is a 100pF capacitor discharged through a 1.5 k Ω resistor into each pin. Note 5: RFADJ is the frequency adjust resistor between FREQ pin and Ground. Note 6: If the LM27241 starts up with a pre-charged soft start capacitor, it will first discharge the capacitor to VSS_RESET and then begin the normal Soft-start process. Note 7: Typical numbers are at 25˚C and represent the most likely norm. www.national.com 7 |
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