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AXG106144 Datasheet(PDF) 3 Page - Panasonic Semiconductor |
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AXG106144 Datasheet(HTML) 3 Page - Panasonic Semiconductor |
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3 / 13 page  Narrow pitch connectors S35 (0.35mm pitch) –3– ACCTB66E 201803-T SPECIFICATIONS 1. Characteristics 2. Material and surface treatment Item Specifications Conditions Electrical characteristics Rated current Max. 0.3 A/pin contact (Max. 5 A at total pin contacts) Rated voltage 60V AC/DC Dielectric strength 150V AC for 1 min. No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for 1 min. Insulation resistance Min. 1,000M Ω (Initial) Using 250V DC megger (applied for 1 min.) Contact resistance Max. 90m Ω According to the contact resistance measurement method of JIS C 5402 Mechanical characteristics Composite insertion force h = 0.6 mm 20 or less pins: Max. 26.0N, pin contact Over 22 pins: Max. 1. 300 N/pin contact × pin contacts (Initial stage) h = 0.8 mm Max. 1. 300 N/pin contact × pin contacts (Initial stage) Composite removal force Min. 0.215N/pin contact × pin contacts Environmental characteristics Ambient temperature –55 to +85 °C No icing. No condensation. Soldering heat resistance The initial specification must be satisfied electrically and mechanically. Reflow soldering: Peak temperature: 260 °C or less (on the surface of the PC board around the connector terminals) Soldering iron: 300 °C within 5 sec. 350°C within 3 sec. Storage temperature –55 to +85 °C (Products only) –40 to +50 °C (Packaging structure) No icing. No condensation. Thermal shock resistance (Header and socket mated) 5 cycles, insulation resistance: Min. 100M Ω, contact resistance: Max. 90m Ω Conformed to MIL-STD-202F, method 107G Humidity resistance (Header and socket mated) 120 hours, insulation resistance: Min. 100M Ω, contact resistance: Max. 90m Ω Conformed to IEC60068-2-78 Temperature 40 ±2°C, Humidity 90 to 95% R.H. Salt water spray resistance (Header and socket mated) 24 hours, insulation resistance: Min. 100M Ω, contact resistance: Max. 90m Ω Conformed to IEC60068-2-11 Temperature 35 ±2°C, Salt water concentration 5±1% H2S resistance (Header and socket mated) 48 hours, contact resistance: Max. 90m Ω Temperature 40 ±2°C, Gas concentration 3±1 ppm, Humidity 75 to 80% R.H. Lifetime characteristics Insertion and removal life 30 times Repeated insertion and removal cycles of max. 200 times/ hour Unit weight 34 pins Socket h = 0.6 mm: 0.01g, h = 0.8 mm: 0.02g 34 pins Header h = 0.6 mm: 0.01g, h = 0.8 mm: 0.01g Part name Material Surface treatment Molded portion LCP resin (UL94V-0) — Contact and Post Copper alloy Contact portion: Base: Ni plating, Surface: Au plating Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips) The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions). Soldering terminals Copper alloy Sockets: Base: Ni plating, Surface: Pd + Au flash plating (except the terminal tips) Headers: Base: Ni plating, Surface: Au plating (except the terminal tips) Order Temperature ( °C) Time (minutes) 1 2 3 4 –55 85 –55 0 −3 30 Max. 5 30 Max. 5 +3 0 0 −3 |
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