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AXG106144 Datasheet(PDF) 3 Page - Panasonic Semiconductor

Part # AXG106144
Description  Automation Controls Catalog
Download  13 Pages
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Manufacturer  PANASONIC [Panasonic Semiconductor]
Direct Link  http://www.panasonic.com/industrial/
Logo PANASONIC - Panasonic Semiconductor

AXG106144 Datasheet(HTML) 3 Page - Panasonic Semiconductor

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Narrow pitch connectors
S35 (0.35mm pitch)
–3–
ACCTB66E 201803-T
SPECIFICATIONS
1. Characteristics
2. Material and surface treatment
Item
Specifications
Conditions
Electrical
characteristics
Rated current
Max. 0.3 A/pin contact (Max. 5 A at total pin contacts)
Rated voltage
60V AC/DC
Dielectric strength
150V AC for 1 min.
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for 1 min.
Insulation resistance
Min. 1,000M
Ω (Initial)
Using 250V DC megger (applied for 1 min.)
Contact resistance
Max. 90m
Ω
According to the contact resistance measurement method of
JIS C 5402
Mechanical
characteristics
Composite insertion force
h = 0.6 mm
20 or less pins: Max. 26.0N, pin contact
Over 22 pins: Max. 1. 300 N/pin contact
× pin
contacts (Initial stage)
h = 0.8 mm Max. 1. 300 N/pin contact
× pin contacts
(Initial stage)
Composite removal force
Min. 0.215N/pin contact
× pin contacts
Environmental
characteristics
Ambient temperature
–55 to +85
°C
No icing. No condensation.
Soldering heat resistance
The initial specification must be satisfied electrically
and mechanically.
Reflow soldering:
Peak temperature: 260
°C or less
(on the surface of the PC board around the connector
terminals)
Soldering iron: 300
°C within 5 sec. 350°C within 3 sec.
Storage temperature
–55 to +85
°C (Products only)
–40 to +50
°C (Packaging structure)
No icing. No condensation.
Thermal shock resistance
(Header and socket mated)
5 cycles,
insulation resistance: Min. 100M
Ω,
contact resistance: Max. 90m
Ω
Conformed to MIL-STD-202F, method 107G
Humidity resistance
(Header and socket mated)
120 hours,
insulation resistance: Min. 100M
Ω,
contact resistance: Max. 90m
Ω
Conformed to IEC60068-2-78
Temperature 40
±2°C, Humidity 90 to 95% R.H.
Salt water spray resistance
(Header and socket mated)
24 hours,
insulation resistance: Min. 100M
Ω,
contact resistance: Max. 90m
Ω
Conformed to IEC60068-2-11
Temperature 35
±2°C, Salt water concentration 5±1%
H2S resistance
(Header and socket mated)
48 hours,
contact resistance: Max. 90m
Ω
Temperature 40
±2°C, Gas concentration 3±1 ppm,
Humidity 75 to 80% R.H.
Lifetime
characteristics
Insertion and removal life
30 times
Repeated insertion and removal cycles of max. 200 times/
hour
Unit weight
34 pins Socket
h = 0.6 mm: 0.01g, h = 0.8 mm: 0.02g
34 pins Header
h = 0.6 mm: 0.01g, h = 0.8 mm: 0.01g
Part name
Material
Surface treatment
Molded portion
LCP resin (UL94V-0)
Contact and Post
Copper alloy
Contact portion: Base: Ni plating, Surface: Au plating
Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel
portions).
Soldering terminals
Copper alloy
Sockets:
Base: Ni plating, Surface: Pd + Au flash plating (except the terminal tips)
Headers:
Base: Ni plating, Surface: Au plating (except the terminal tips)
Order Temperature (
°C)
Time (minutes)
1
2
3
4
–55
85
–55
0
−3
30
Max. 5
30
Max. 5
+3
0
0
−3


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