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AXT510124 Datasheet(PDF) 3 Page - Panasonic Semiconductor |
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AXT510124 Datasheet(HTML) 3 Page - Panasonic Semiconductor |
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3 / 13 page  Narrow pitch connectors F4S (0.4mm pitch) –3– ACCTB29E 201809-T SPECIFICATIONS 1. Characteristics 2. Material and surface treatment Item Specifications Conditions Electrical characteristics Rated current 0.3A/pin contact (Max. 5 A at total pin contacts) Rated voltage 60V AC/DC Dielectric strength 150V AC for 1 min. No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute. Insulation resistance Min. 1,000M Ω (initial) Using 250V DC megger (applied for 1 min.) Contact resistance Max. 90m Ω Based on the contact resistance measurement method specified by JIS C 5402. Mechanical characteristics Composite insertion force Max. 0.981N/pin contact × pin contacts (initial) Composite removal force Min. 0.165N/pin contact × pin contacts Environmental characteristics Ambient temperature –55 to +85 °C No icing. No condensation. Soldering heat resistance The initial specification must be satisfied electrically and mechanically. Reflow soldering: Peak temperature: 260 °C or less (on the surface of the PC board around the connector terminals) Soldering iron: 300 °C within 5 sec. 350°C within 3 sec. Storage temperature –55 to +85 °C (product only) –40 to +50 °C (emboss packing) No icing. No condensation. Thermal shock resistance (header and socket mated) 5 cycles, insulation resistance min. 100M Ω, contact resistance max. 90m Ω Conformed to MIL-STD-202F, method 107G Humidity resistance (header and socket mated) 120 hours, insulation resistance min. 100M Ω, contact resistance max. 90m Ω Conformed to IEC60068-2-78 Temperature 40 ±2°C, humidity 90 to 95% R.H. Saltwater spray resistance (header and socket mated) 24 hours, insulation resistance min. 100M Ω, contact resistance max. 90m Ω Conformed to IEC60068-2-11 Temperature 35 ±2°C, saltwater concentration 5±1% H2S resistance (header and socket mated) 48 hours, contact resistance max. 90m Ω Temperature 40 ±2°C, gas concentration 3±1 ppm, humidity 75 to 80% R.H. Lifetime characteristics Insertion and removal life 50 times Repeated insertion and removal speed of max. 200 times/ hours Unit weight 20 pins Socket: 0.03 g Header: 0.01 g Part name Material Surface treatment Molded portion LCP resin (UL94V-0) — Contact and Post Copper alloy Contact portion: Base: Ni plating Surface: Au plating Terminal portion: Base: Ni plating Surface: Au plating (except the terminal tips) The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions). Soldering terminals Copper alloy Sockets: Base: Ni plating, Surface: Pd + Au flash plating (except the terminal tips) Headers: Base: Ni plating, Surface: Au plating (except the terminal tips) Order Temperature ( °C) Time (minutes) 1 2 3 4 –55 85 –55 0 −3 30 Max. 5 30 Max. 5 +3 0 0 −3 Partly to Be Discontinued Last time buy: September 30, 2019 |
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Similar Description - AXT510124 |
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