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THS4631DRG4 Datasheet(PDF) 2 Page - Texas Instruments |
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THS4631DRG4 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 27 page www.ti.com ABSOLUTE MAXIMUM RATINGS PACKAGE DISSIPATION RATINGS RECOMMENDED OPERATING CONDITIONS THS4631 SLOS451A – DECEMBER 2004 – REVISED MARCH 2005 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. over operating free-air temperature range (unless otherwise noted)(1) UNITS VS Supply voltage, VS– to VS+ 33 V VI Input voltage ±VS IO(2) Output current 150 mA Continuous power dissipation See Dissipation Rating Table TJ Maximum junction temperature(2) 150°C TA Operating free-air temperature, continues operation, long-term reliability(2) 125°C Tstg Storage temperature range 65°C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300°C HBM 1000 V ESD ratings: CDM 1500 V MM 100 V (1) The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may result in reduced reliability and/or lifetime of the device. POWER RATING(1) (TJ =125°C) PACKAGE θ JC (°C/W) θ JA (°C/W) TA ≤ 25°C TA = 85°C D (8)(2) 38.3 95 1.1 W 0.47 W DDA (8) 9.2 45.8 2.3 W 0.98 W DGN (8) 4.7 58.4 2.14 W 1.11 W (1) Power rating is determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance. (2) This data was taken using the JEDEC standard High-K test PCB. over operating free-air temperature range (unless otherwise noted) MIN MAX UNITS Dual Supply ±5 ±15 VS Supply Voltage V Single Supply 10 30 TA Operating free-air temperature -40 85 °C 2 |
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