EMI803x Series

www.onsemi.com

9

PACKAGE DIMENSIONS

XDFN16 4.0x1.35, 0.5P

CASE 711AZ

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND

0.30 mm FROM THE TERMINAL TIP.

A

B

E

D

BOTTOM VIEW

b

e

16X

0.10

B

0.05

A

C

2X

0.10 C

PIN ONE

REFERENCE

TOP VIEW

2X

0.10 C

16X

A

A1

(A3)

0.08 C

0.10 C

PLANE

SIDE VIEW

L

16X

1

8

9

16

DETAIL B

0.25

1.55

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

1

DETAIL A

DIM

MIN

MAX

MILLIMETERS

A

0.40

0.50

A1

0.00

0.05

A3

0.15 REF

b

0.15

0.25

D

4.00 BSC

L

0.40

0.60

E

1.35 BSC

e

0.50 BSC

L1

−−−

0.15

DETAIL B

MOLD CMPD

EXPOSED Cu

ALTERNATE

CONSTRUCTION

L1

DETAIL A

L

ALTERNATE TERMINAL

CONSTRUCTIONS

L

e/2

0.48

15X

0.50

PITCH

0.65

16X

RECOMMENDED

L2

L2

0.20 REF

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