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APL1117-28FC-TR Datasheet(PDF) 11 Page - Anpec Electronics Coropration |
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APL1117-28FC-TR Datasheet(HTML) 11 Page - Anpec Electronics Coropration |
11 / 18 page Copyright ANPEC Electronics Corp. Rev. B.8 - Jun., 2003 APL1117 www.anpec.com.tw 11 Application Information (Cont.) The thermal resistance for each application will be affected by thermal interactions with other compo- nents on the board. Some experimentation will be necessary to determine the actual value. The power dissipation of APL1117 is equal to : PD = (VIN - VOUT) x IOUT Maximum junction temperature is equal to : TJUNCTION = TAMBIENT + (PD x θJA) Note: TJUNCTION must not exceed 125°C Thermal Considerations (Cont.) 30 35 40 45 50 55 60 0 2 4 6 8 10 12 14 TA=25°C Top Copper Area (cm2) Figure 4. θ(J-A) vs. copper area for the SOT-223 package |
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