30/36

TSZ02201-0F2F0AJ00280-1-2

© 2020 ROHM Co., Ltd. All rights reserved.

11.Jun.2020 Rev.001

www.rohm.com

TSZ22111 • 15 • 001

BD9G500EFJ-LA

PCB Layout Design - continued

Accordingly, design the PCB layout with particular attention paid to the following points.

·Provide the input capacitor close to the VIN pin of the IC as possible on the same plane as the IC.

·If there is any unused area on the PCB, provide a copper foil plane for the ground node to assist heat dissipation from the IC

and the surrounding components.

·Switching nodes such as SW are susceptible to noise due to AC coupling with other nodes. Trace to the coil and catch diode

as thick and short as possible.

·Provide lines connected to the FB pin and the COMP pin as far from the SW node.

·Provide the output capacitor away from the input capacitor in order to avoid the effect of harmonic noise from the input.

Top Layer

Bottom Layer

Figure 62. Example of Sample Board Layout Pattern