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HCD66765BP Datasheet(PDF) 4 Page - Hitachi Semiconductor |
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HCD66765BP Datasheet(HTML) 4 Page - Hitachi Semiconductor |
4 / 71 page HD66765 4 Preliminary Specification HD66765 PAD Arrangement (Top View) HD66765 Y X SEG77 DUMMY1 DUMMY40 DUMMY41 DUMMY42 - Chip size : 13.22mm x 3.85mm - Chip thickness : 550um (typ.) - PAD coordinate : PAD center - Coordinate origine : Chip center - Au bump size : (1) 80um x 80 um DUMMY1, DUMMY2-DUMMY39, DUMMY40, DUMMY41, DUMMY42 (2) 35um x 80um SEG304-SEG93 (3) 80um x 35um SEG386-SEG321, SEG76-SEG11 (4) 45um x 80um SEG10-SEG1, SEG396-SEG387, SEG320-SEG305, SEG92-SEG77 - Au bump pitch : Refer PAD coordinate - Au bump height : 15um (typ.) SEG78 SEG94 SEG93 SEG305 SEG306 SEG320 SEG319 SEG304 SEG303 Vcc Vcc Vcc GND GND GND CS* Vcc GND VSH VSH VSH VSH GND GND Vcc Vcc VSH VSH RW/RD* RS OSC2 RESET GNDDUM2 VccDUM1 IM1 IM2 CL1 FLM DISPTMG CCL DCCLK DB15 RESET DB14 DB12 DB13 DB11 DB10 DB9 GNDDUM1 DB8 DB7 DB6 DB5 DB3 DB4 DB2 DB0/SDI DB1/SDO E/WR*/SCL GND GND GND GND GND OSC1 IM0/ID TEST M CCS CDA SEG92 SEG91 SEG1 SEG2 SEG9 SEG10 SEG387 SEG388 SEG395 SEG396 DUMMY17 DUMMY16 DUMMY3 DUMMY2 DUMMY39 DUMMY38 DUMMY19 DUMMY18 No.1 No.2 No.500 No.434 No.435 No.433 No.122 No.123 No.121 No.189 No.188 No.190 |
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