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PFM18030F Datasheet(PDF) 1 Page - List of Unclassifed Manufacturers

Part # PFM18030F
Description  1805-1880 MHz, 30W, 2-Stage Power Module Enhancement-Mode Lateral MOSFETs
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Manufacturer  ETC1 [List of Unclassifed Manufacturers]
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PFM18030F Datasheet(HTML) 1 Page - List of Unclassifed Manufacturers

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PRELIMINARY 
Page 1 of 13 
Specifications subject to change without notice.  U.S. Patent No. 6,822,321 
Rev. 3 
http://www.cree.com/ 
PFM18030 SPECIFICATION 
1805­1880 MHz, 30W, 2­Stage Power Module 
Enhancement­Mode Lateral MOSFETs 
This versatile DCS module provides excellent linearity and efficiency in a 
low­cost surface mount package.  The PFM18030SM includes two stages 
of amplification, along with internal sense FETs that are on the same 
silicon die as the RF devices.  These thermally coupled sense FETs 
simplify the task of bias temperature compensation of the overall amplifier. 
The module includes RF input, interstage, and output matching elements. 
The source and load impedances required for optimum operation of the 
module are much higher (and simpler to realize) than for unmatched Si 
LDMOS transistors of similar performance. 
The surface mount package base is typically soldered to a conventional 
PCB pad with an array of via holes for grounding and thermal sinking of 
the module.  Optimized internal construction supports low FET channel 
temperature for reliable operation.
· 29 dB Gain
· 30 Watts Peak Output Power
· Internal Tracking FETs 
(for improved bias control)
· IS95 CDMA Performance 
5 Watts Average Output Level 
20% Power Added Efficiency 
–49 dBc ACPR 
Module Schematic Diagram 
Note:  Additionally, there are 250 KOhm resistors connected in shunt with all leads, to enhance ESD protection. 
Gate 1 
RF IN 
Sense S1 
Gate 2 
Sense S2 
D1 
Drain 2 
RF OUT 
Lead 
Lead 
Lead 
Lead 
Lead 
Lead 
Q1 
Input 
Match 
Q2 
Input 
Match 
Output 
Match 
S1 
Q1 Die Carrier 
Q2 Die Carrier 
Module Substrate 
S2 
Output 
Match 
Package Type: Surface Mount 
PN: PFM18030SM 
Package Type: Flange 
PN: PFM18030F


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