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222215365471 Datasheet(PDF) 3 Page - Vishay Siliconix |
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222215365471 Datasheet(HTML) 3 Page - Vishay Siliconix |
3 / 8 page Document Number: 28302 For technical questions contact: aluminumcaps1@vishay.com www.vishay.com Revision: 07-Nov-05 3 153 CLV Aluminum Capacitors SMD (Chip) Long Life Vertical Vishay BCcomponents Table 2 DIMENSIONS in millimeters AND MASS NOMINAL CASE SIZE L × W × H CASE CODE Lmax Wmax Hmax ∅DB max SC MASS (g) 4.0 × 4.0 × 5.3 0405 4.5 4.5 5.5 4.0 0.8 1.0 2.0 ± 0.2 ≈ 0.13 5.0 × 5.0 × 5.3 0505 5.5 5.5 5.5 5.0 0.8 1.4 2.3 ± 0.2 ≈ 0.20 6.3 × 6.3 × 5.3 0605 6.8 6.8 5.5 6.3 0.8 2.0 2.7 ± 0.2 ≈ 0.30 8.0 × 8.0 × 6.5 0807 8.6 8.6 6.8 8.0 0.8 2.3 3.4 ± 0.2 ≈ 0.50 8.0 × 8.0 × 10 0810 8.6 8.6 10.5 8.0 1.1 3.1 3.0 ± 0.2 ≈ 1.00 10 × 10 × 10 1010 10.6 10.6 10.5 10.0 1.1 4.7 3.3 ± 0.2 ≈ 1.30 10 × 10 × 12 1012 10.6 10.6 12.3 10.0 1.2 4.5 3.9 ± 0.2 ≈ 1.40 10 × 10 × 14 1014 10.6 10.6 14.3 10.0 1.2 4.5 3.9 ± 0.2 ≈ 1.50 Fig.2 Dimensional outline. H W B 0.3 max. 0.4 ±0.2 D CC S L MOUNTING The capacitors are designed for automatic placement on to printed-circuit boards. Optimum dimensions of soldering pads depend amongst others on soldering method, mounting accuracy, print layout and/or adjacent components. For recommended soldering pad dimensions, refer to Fig.3 and Table 3. SOLDERING Soldering conditions are defined by the curve, temperature versus time, where the temperature is that measured on the soldering pad during processing. For maximum conditions refer to Fig.4. Any temperature versus time curve which does not exceed the specified maximum curves may be applied. AS A GENERAL PRINCIPLE, TEMPERATURE AND DURATION SHALL BE THE MINIMUM NECESSARY REQUIRED TO ENSURE GOOD SOLDERING CONNECTIONS. HOWEVER, THE SPECIFIED MAXIMUM CURVES SHOULD NEVER BE EXCEEDED. Fig.3 Recommended soldering pad dimensions. c a a b Table 3 RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters CASE CODE a b c 0405 2.6 1.6 1.0 0505 3.0 1.6 1.4 0605 3.5 1.6 1.9 0807 4.0 1.6 2.1 0810 3.5 2.5 3.0 1010 4.0 2.5 4.0 1012 4.3 2.5 4.0 1014 4.3 2.5 4.0 250 280 80 0 50 200 180 150 100 200 220 240 260 160 140 120 100 T PAD ( C) o t (s) Fig.4 Maximum temperature load during infrared reflow soldering measured on the soldering pad. |
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