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M69KB096AA70CW8 Datasheet(PDF) 9 Page - STMicroelectronics

Part # M69KB096AA70CW8
Description  64 Mbit (4M x16) 1.8V Supply, 80MHz Clock Rate, Burst PSRAM
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

M69KB096AA70CW8 Datasheet(HTML) 9 Page - STMicroelectronics

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M69KB096AA
be accessed. It also allows any pending refresh
operations
to
be
performed
(see
Figure
22., Continuous Burst Read Showing an Output
Delay for End-of-Row Condition (BCR8=0,1)).
The processor can access other devices without
being submitted to the initial burst latency by sus-
pending the burst operation. Burst operations can
be suspended by halting the Clock signal, holding
it High or Low. If another device needs to use the
data bus while Burst operations are suspended,
the Output Enable signal, G, should be driven
High, VIH, to disable data outputs; otherwise, G
can remain Low, VIL. The WAIT output will remain
asserted to prevent any other devices from using
the processor WAIT line.
Burst operations can be resumed by taking G Low,
VIL, and then restarting the Clock as soon as valid
data are available on the bus (see Figure
21., Synchronous Burst Read Suspend and Re-
sume Waveforms).
Mixed Mode
When the BCR register is configured for synchro-
nous operation, the device can support a combina-
tion
of
Synchronous
Burst
Read
and
Asynchronous Random Write operations.
The Asynchronous Random Write operation re-
quires that the Clock signal remains Low, VIL, dur-
ing the entire sequence. The L signal can either be
used to latch the target address or remain Low,
VIL, during the entire Write operation. E must re-
turn Low, VIL, during Asynchronous and Burst op-
erations. Note that the time, necessary to assure
adequate refresh, is the same value as that for
Asynchronous Read and Write mode.
Mixed-mode operation greatly simplifies the inter-
facing with traditional burst-mode Flash Memory
Controllers.
Low-Power Modes
Standby Mode. During Standby, the device cur-
rent consumption is reduced to the level neces-
sary to perform the memory array refresh
operation. Standby operation occurs when E is
High, VIH, and no transaction is in progress.
The device will enter Standby mode when a Read
or Write operation is completed, or when the ad-
dress and control inputs remain stable for an ex-
tended period of time. This “active” Standby mode
will continue until address or control inputs
change.
Temperature Compensated Refresh. The
Temperature Compensated Refresh (TCR) is
used to adjust the refresh rate depending on the
device operating temperature.
The leakage current of DRAM capacitive storage
elements increases with the temperature. PSRAM
devices, based on a DRAM architecture, conse-
quently require increasingly frequent refresh oper-
ations
to
maintain
data
integrity
as
the
temperature increases. At lower temperatures, the
refresh rate can be decreased to minimize the
standby current.
The TCR mechanism allows adequate refresh
rates to be set at four different temperature thresh-
olds. These are defined by setting the RCR5 and
RCR6 bits of the Refresh Configuration Register,
RCR. To minimize the self refresh current con-
sumption, the selected setting must be higher than
the operating temperature of the PSRAM device.
As an example, if the operating temperature is
+50°C, the +70°C setting must be selected; the
+15°C and +45°C settings would result in inade-
quate refreshing and could cause data corruption.
See Table 9. for the definition of the Refresh Con-
figuration Register bits.
Partial Array Refresh. The Partial Array Refresh
(PAR) performs a limited refresh of part of the
PSRAM array. This mechanism enables the de-
vice to reduce the standby current by refreshing
only the part of the memory array that contains es-
sential data. Different refresh options can be de-
fined by setting the RCR0 to RCR2 bits of the RCR
Register:
Full array
One half of the array
One quarter of the array
One eighth of the array
None of the array.
These memory areas can be located either at the
top or bottom of the memory array.
The WAIT signal is used for arbitration when a
read/write operation is launched while an on-chip
refresh is in progress. If locations are addressed
while they are undergoing refresh, the WAIT signal
will be asserted for additional clock cycles, until
the refresh has completed (see Figure 6. and Fig-
ure 7., Collision between Refresh and Read or
Write Operations). When the refresh operation is
completed, the Read or Write operation will be al-
lowed to continue normally.


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