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K6F2016R4G-FF70 Datasheet(PDF) 3 Page - Samsung semiconductor |
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K6F2016R4G-FF70 Datasheet(HTML) 3 Page - Samsung semiconductor |
3 / 10 page Revision 0.0 CMOS SRAM April 2005 K6F2016R4G Family - 3 - Preliminary 128K x 16 bit Super Low Power and Low Voltage Full CMOS Static RAM PIN DESCRIPTION FUNCTIONAL BLOCK DIAGRAM 48-FBGA: Top View (Ball Down) LB OE A0 A1 A2 DNU I/O9 UB A3 A4 CS I/O1 I/O10 I/O11 A5 A6 I/O2 I/O3 Vss I/O12 DNU A7 I/O4 Vcc Vcc I/O13 DNU A16 I/O5 Vss I/O15 I/O14 A14 A15 I/O6 I/O7 I/O16 DNU A12 A13 WE I/O8 DNU A8 A9 A10 A11 DNU 1 234 56 A B C D E F G H SAMSUNG ELECTRONICS CO., LTD. reserves the right to change products and specifications without notice . Name Function Name Function CS Chip Select Input Vcc Power OE Output Enable Input Vss Ground WE Write Enable Input UB Upper Byte(I/O9~16) A0~A16 Address Inputs LB Lower Byte(I/O1~8) I/O1~I/O16 Data Inputs/Outputs DNU Do Not Use Precharge circuit. Memory Cell Array I/O Circuit Column select Clk gen. Row select WE OE UB CS I/O1~I/O8 Data cont Data cont Data cont LB I/O9~I/O16 Vcc Vss Row Addresses Control Logic Column Addresses PRODUCT FAMILY 1. The parameter is measured with 30pF test load. 2. Typical values are measured at VCC=1.8V, TA=25 °C and not 100% tested. Product Family Operating Temperature Vcc Range Speed Power Dissipation PKG Type Standby (ISB1, Typ.) Operating (ICC1, Max) K6F2016R4G-F Industrial(-40~85 °C) 1.65~1.95V 701)/85ns 0.5 µA2) 2mA 48-FBGA-6.00x7.00 GENERAL DESCRIPTION The K6F2016R4G families are fabricated by SAMSUNG ′s advanced full CMOS process technology. The families support industrial temperature range and 48 ball Chip Scale Package for user flexibility of system design. The family also supports low data retention voltage for battery back-up operation with low data retention current. FEATURES • Process Technology: Full CMOS • Organization: 128K x16 bit • Power Supply Voltage: 1.65~1.95V • Low Data Retention Voltage: 1.0V(Min) • Three State Outputs • Package Type: 48-FBGA-6.00x7.00 |
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