®

AS4C256K16FO

4/11/01; V.0.9.1

Alliance Semiconductor

P. 3 of 25

Absolute maximum ratings

Note: Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional

operation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect reliability.

DC electrical characteristics

Parameter

Symbol

Min

Max

Unit

Input voltage

–1.0

+7.0

V

Output voltage

–1.0

+7.0

V

Power supply voltage

–1.0

+7.0

V

Operating temperature

0+70

°C

Storage temperature (plastic)

–55

+150

°C

Soldering temperature

× time

–260

× 10

°C × sec

Power dissipation

–1

W

Short circuit output current

–50

mA

Latch-up current

200

–

mA

Parameter

Symbol

Test conditions

–25–30

–35–50

Unit Note

Min

Max

Min

Max

Min

Max

Min

Max

Input leakage

current

0V

≤ V

pins not under test = 0V

–1010

–10

10

–1010–10

10

µA

Output leakage

current

0V

≤ V

–1010

–10

10

–1010–10

10

µA

Operating

power supply

current

RAS, UCAS, LCAS, address

–200

–180

–160

–140

mA

1,2

TTL standby

power supply

current

RAS = UCAS = LCAS = VIH

–

2.0

–

2.0

–

2.0

–

2.0

mA

Average power

supply current,

RAS refresh

mode

RAS cycling,

–120

–200

–190

–140

mA

1

Fast page mode

average power

supply current

–130

–190

–180

–

70

mA

1,2

CMOS standby

power supply

current

RAS = UCAS = LCAS =

–

0.60

–

1.0

–

1.0

–

1.0

mA

CAS-before-RAS

refresh power

supply current

RAS, UCAS, LCAS, cycling;

–120

–200

–190

–140

mA

1

Output voltage

2.4

–

2.4

–

2.4

–

2.4

–

V

–

0.4

–

0.4

–

0.4

–

0.4

V

Self refresh

current

are open

–

2.0

–

2.0

–

2.0

–

2.0

mA