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PE42660 Datasheet(PDF) 5 Page - Peregrine Semiconductor Corp. |
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PE42660 Datasheet(HTML) 5 Page - Peregrine Semiconductor Corp. |
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5 / 9 page  Preliminary Specification PE42660 Page 5 of 9 Document No. 70-0192-02 │ www.psemi.com ©2005 Peregrine Semiconductor Corp. All rights reserved. Electrical Test and Performance Specifications PE42660 dice are 100% electrically tested for the parameters listed below from Table 1 and Table 2. All other parameters are guaranteed through design and characterization. Wafer and Die Packaging Peregrine Semiconductor has two methods for shipping dice to our customers. The shipping option used is based on the customer’s requirements and the number of dice. Peregrine offers product dice in two packaging options: Standard Die Carrier Packages (waffle pack) and dice on Film Frames. Wafer Mount/Dicing In preparation for dicing, wafers are thinned and polished and 100% electrically probed prior to mounting on film frame tape and rings. Figure 6 shows a wafer mounted on film frame using PVC backed mounting tape. In preparation for shipment, wafers are visually inspected after singulation and shipped with an electronic map file providing good dice locations. • Insertion Loss (all ports) • TX1 & TX2 Harmonics • TX – RX Isolation • I DD supply current • Control pin leakages Storage and Preservation Proper storage conditions are necessary to prevent product contamination and/or degradation after shipment. Product should be stored in the original unopened packaging or, once opened, in a nitrogen purged cabinet at room temperature (45% + 15% relative humidity controlled environment). Singulated wafers mounted on film frames are intended for immediate use and have a limited shelf life. This is primarily due to the nature of the adhesive tape used for mounting the product. This product can be stored up to 30 days. This applies whether or not the material has remained in its original sealed container. To reduce the risk of contamination or degradation, it is recommended that product not being used in the assembly process be returned to their original containers and resealed with a vacuum seal process. Figure 6. Wafer on Film Frame Figure 8. Waffle Pack Wafer Processing Visual Inspection Process Control Monitor (PCM) Wafer Level Reliability (WLR) Backgrind and Polish Dice Picking 100% Electrical Test Ink Reject Die or Electronic Wafer Map Outgoing QA Inspection Wafer Singulation 100% Visual Inspection Pack and Ship Wafers Carrier Loading Pack and Ship Dice Figure 7. Dice and Wafer Processing Flow Standard Die Carrier Package/Waffle Pack Waffle packs are available to customers during product development and prototyping phase only. Orders will move to film frames at production launch or for large quantity requirements. Dice have been 100% electrically probed, singulated, visually inspected and are packaged in a 2”x2” waffle pack (400 dice per waffle pack). |
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