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LM27964SQ-I Datasheet(PDF) 5 Page - National Semiconductor (TI) |
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LM27964SQ-I Datasheet(HTML) 5 Page - National Semiconductor (TI) |
5 / 13 page Electrical Characteristics (Notes 2, 8) (Continued) Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. Note 2: All voltages are with respect to the potential at the GND pin. Note 3: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 170˚C (typ.) and disengages at TJ = 165˚C (typ.). Note 4: For detailed soldering specifications and information, please refer to National Semiconductor Application Note 1187: Leadless Leadframe Package (AN-1187). Note 5: The Human body model is a 100pF capacitor discharged through a 1.5k Ω resistor into each pin. MIL-STD-883 3015.7 Note 6: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 100˚C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (θJA), as given by the following equation: TA-MAX =TJ-MAX-OP –(θJA xPD-MAX). Note 7: Junction-to-ambient thermal resistance is highly dependent on application and board layout. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. For more information, please refer to National Semiconductor Application Note 1187: Leadless Leadframe Package (AN-1187). Note 8: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm. Note 9: CIN,CPOUT,C1, and C2 : Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics Note 10: The maximum total output current for the LM27964 should be limited to 180mA. The total output current can be split among any of the three banks (IDxA =IDxB = 30mA Max., IDKEY = 80mA Max.). Under maximum output current conditions, special attention must be given to input voltage and LED forward voltage to ensure proper current regulation. See the Maximum Output Current section of the datasheet for more information. Note 11: For each IDxx output pin, headroom voltage is the voltage across the internal current sink connected to that pin. For Group A and B outputs, VHR =VOUT -VDxx. If headroom voltage requirement is not met, LED current regulation will be compromised. Note 12: For the two groups of outputs on a part (BankA and BankB), the following are determined: the maximum output current in the group (MAX), the minimum output current in the group (MIN), and the average output current of the group (AVG). For each group, two matching numbers are calculated: (MAX-AVG)/AVG and (AVG-MIN)/AVG. The largest number of the two (worst case) is considered the matching figure for the bank. The matching figure for a given part is considered to be the highest matching figure of the two banks. The typical specification provided is the most likely norm of the matching figure for all parts. Note 13: SCL and SDIO should be glitch-free in order for proper brightness control to be realized. Block Diagram 20138103 www.national.com 5 |
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