Electronic Components Datasheet Search |
|
MC34652R2 Datasheet(PDF) 4 Page - Freescale Semiconductor, Inc |
|
MC34652R2 Datasheet(HTML) 4 Page - Freescale Semiconductor, Inc |
4 / 25 page Analog Integrated Circuit Device Data 4 Freescale Semiconductor 34652 MAXIMUM RATINGS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit ELECTRICAL RATINGS Power Supply Voltage VPWR 85 V Power MOSFET Energy Capability EMOSFET Varies (1) mJ Continuous Output Current (2) IO(CONT) 2.0 A Maximum Voltage DISABLE Terminal UV Terminal OV, ILIM, ICHG, and TIMER Terminals PG Terminal (VPG - VIN) PG Terminal (VPG - VIN) — — — — — VIN - 0.3 to VPWR + 5.5 7.0 5.0 85 85 V All Terminals Minimum Voltage — -0.3 V PG, PG Maximum Current — Internally Limited A ESD Voltage, All Terminals Human Body Model (3) Machine Model (4) VESD3 VESD4 ±2000 ±200 V THERMAL RATINGS Storage Temperature TSTG -65 to 150 °C Operating Temperature Ambient (5) Junction TA TJ -40 to 85 -40 to 160 °C Peak Package Reflow Temperature During Solder Mounting (6) TSOLDER 260 °C Thermal Resistance (7), (8) Junction-to-Ambient, Single-Layer Board (9) Junction-to-Ambient, Four-Layer Board (10) RθJA RθJMA 103 65 °C/W Notes 1. Refer to the section titled Power MOSFET Energy Capability on page 22 for a detailed explanation on this parameter. 2. Continuous output current capability so long as TJ is ≤ 160°C. 3. ESD1 testing is performed in accordance with the Human Body Model (CZAP=100pF, RZAP=1500 Ω). 4. ESD2 testing is performed in accordance with the Machine Model (CZAP=200 pF, RZAP=0 Ω). 5. The limiting factor is junction temperature, taking into account power dissipation, thermal resistance, and heatsinking. 6. Terminal soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 7. Refer to the section titled Thermal Shutdown on page 15 for more thermal resistance values under various conditions. 8. The VOUT and VIN terminals comprise the main heat conduction paths. 9. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal. 10. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal. There are no thermal vias connecting the package to the two planes in the board. |
Similar Part No. - MC34652R2 |
|
Similar Description - MC34652R2 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |