3

®

OPA644

1

2

3

4

8

7

6

5

+V

S2

(1)

+V

S1

Output

–V

S2

(1)

NC

–Input

+Input

–V

S1

The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes

no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change

without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant

any BURR-BROWN product for use in life support devices and/or systems.

PIN CONFIGURATION (All Packages)

Top View

SO-8

NOTE: (1) Making use of all four power supply pins is highly recommended,

although not required. Using these four pins, instead of just pins 4 and 7, will

lower the effective pin impedance and substantially lower distortion.

PACKAGE /ORDERING INFORMATION

PACKAGE DRAWING

PRODUCT

PACKAGE

OPA644U, UB

SO-8 Surface Mount

182

NOTE: (1) For detailed drawing and dimension table, please see end of data

sheet, or Appendix C of Burr-Brown IC Data Book. (2) The “B” grade of the

SO-8 package will be marked with a “B” by pin 8.

ABSOLUTE MAXIMUM RATINGS

Power Supply ..............................................................................

±5.5VDC

Internal Power Dissipation .......................... See Thermal Considerations

Differential Input Voltage ..................................................................

±1.2V

Input Voltage Range ............................................................................

±V

S

Storage Temperature Range: U, UB ............................ –40

°C to +125°C

Lead Temperature (soldering, 10s) .............................................. +300

°C

(soldering, SO-8 3s) ....................................... +260

°C

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Burr-Brown

recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.