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M63994P Datasheet(PDF) 8 Page - Mitsubishi Electric Semiconductor |
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M63994P Datasheet(HTML) 8 Page - Mitsubishi Electric Semiconductor |
8 / 8 page Sep. 2000 DIP8-P-300-2.54 Weight(g) – JEDEC Code 0.5 EIAJ Package Code Lead Material Cu Alloy 8P4 Plastic 8pin 300mil DIP – – –– 9.1 8.7 3.0 – – Symbol Min Nom Max A A2 b b1 b2 c L Dimension in Millimeters A1 – – 15 ° – – 7.62 – – 2.45 – 6.45 6.3 6.15 8.9 0.34 0.27 0.22 1.3 1.0 0.9 1.8 1.5 1.4 0.6 0.5 0.4 3.3 0.51 4.5 0 ° E D e1 e 8 5 4 1 D SEATING PLANE b1 b b2 e MITSUBISHI SEMICONDUCTORS <HVIC> M63994P/FP HIGH VOLTAGE HALF BRIDGE DRIVER PACKAGE OUTLINE SOP8-P-225-1.27 Weight(g) – JEDEC Code 0.07 EIAJ Package Code Lead Material Cu Alloy 8P2S-A Plastic 8pin 225mil SOP Symbol Min Nom Max A A2 b c D E HE L L1 y b2 Dimension in Millimeters A1 I2 0.05 – – –1.5 – 0.35 0.4 0.5 0.13 0.15 0.2 4.8 5.0 5.2 4.2 4.4 4.6 –1.27 – 5.9 6.2 6.5 0.2 0.4 0.6 –0.9 – – – 0.1 0 ° –10 ° –0.76 – –5.72 – 1.27 – – – – 1.9 e e1 8 5 4 1 D b e y F A A2 A1 c Detail F e b2 Recommended Mount Pad |
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