• Changed Thermal Information for the LM158FK and LM158JG devices........................................................... 6

• Added Typical Characteristics section for the LM358B and LM2490B op amps.............................................. 16

• Added test circuit for THD+N and small-signal step response, G = –1 in the Parameter Measurement

Information section........................................................................................................................................... 25

• Changed the Functional Block Diagram .......................................................................................................... 26

Changes from Revision U (January 2017) to Revision V (September 2018)

Page

• Changed the data sheet title ..............................................................................................................................1

• Changed first four items in the Features section ............................................................................................... 1

• Changed the first item in the Applications section and added four new items ...................................................1

• Changed voltage values in the first paragraph of the Description section..........................................................1

• Changed text in the second paragraph of the Description section..................................................................... 1

• Added devices LM358B and LM2904B to data sheet.........................................................................................1

• Changed the first three rows of the Device Information table and added a a cross-referenced note for

PREVIEW-status devices................................................................................................................................... 1

• Added a table note to the Pin Functions table ................................................................................................... 4

• Changed "free-air temperature" to "ambient temperature" in the Absolute Maximum Ratings condition

statement............................................................................................................................................................ 5

• Deleted lead temperature and case temperature from Absolute Maximum Ratings ......................................... 5

• Changed device listings and their voltage values in the ESD Ratings table ......................................................5

• Changed "free-air temperature" to "ambient temperature" in the Recommended Operating Conditions

condition statement ............................................................................................................................................6

• Changed table entries for all parameters in the Recommended Operating Conditions table.............................6

• Added rows to the Thermal Information table, and a table note regarding device-package combinations ....... 6

• Deleted the Operating Conditions table............................................................................................................15

• Added a condition statement to the Typical Characteristics section.................................................................23

• Changed specific voltages to a Recommended Operating Conditions reference............................................ 26

• Changed unity-gain bandwidth from 0.7 MHz for all devices to 1.2 MHz for B-version devices.......................27

• Changed slew rate from.3 V/µs for all devices to o.5 V/µs for B-version devices............................................ 27

• Changed the Section 8.3.3 section in multiple places throughout.................................................................... 27

• Changed Operational Amplifier Board Layout for Noninverting Configuration with an image that includes a

dual op amp...................................................................................................................................................... 30

Changes from Revision T (April 2015) to Revision U (January 2017)

Page

• Changed data sheet title.....................................................................................................................................1

Changes from Revision S (January 2014) to Revision T (April 2015)

Page

• Added Applications section, ESD Ratings table, Feature Description section, Device Functional Modes,

Application and Implementation section, Power Supply Recommendations section, Layout section, Device

and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ........... 1

Changes from Revision R (July 2010) to Revision S (Jauary 2014)

Page

• Converted this data sheet from the QS format to DocZone using the PDF on the web..................................... 1

• Deleted Ordering Information table.....................................................................................................................1

• Updated Features to include Military Disclaimer................................................................................................ 1

• Added Typical Characteristics section.............................................................................................................. 23

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LM158, LM158A, LM258, LM258A

LM2904, LM2904B, LM2904BA, LM2904V

LM358, LM358A, LM358B, LM358BA

SLOS068AA – JUNE 1976 – REVISED MARCH 2022

Copyright © 2022 Texas Instruments Incorporated

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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358

LM358A LM358B LM358BA