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SP4425Q Datasheet(PDF) 2 Page - Sipex Corporation |
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SP4425Q Datasheet(HTML) 2 Page - Sipex Corporation |
2 / 12 page SP4425QDS/12 SP4425Q Electroluminescent Lamp Driver © Copyright 1998 Sipex Corporation 2 (T= 25 °C; V DD = 3.0V; see test circuit schematic page 6; Coil = 2mH/44ohms; COSC = 180pF, CINT = 820pF unless otherwise noted) V SS HON D1 Coil C OSC EL2 V DD EL1 SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability. V DD.......................................................................................................5V Input Voltages/Currents HON (pin1)........................................-0.5V to (V DD + 0.5V) COIL (pin3)............................................................100mA Lamp Outputs..............................................................................230V PP Storage Temperature....................................................-65˚C to +150˚C NOTES: 1. Dimensions are in Microns unless otherwise noted. 2. Bonding pads are 125x125 typ. 3. Outside dimensions are maximum, including scribe area. 4. Die thickness is 380 +/- 25 microns (15 mils +/- 1). 5. Pad center coordinates are relative to die center. 6. Die size 74 x 44 mils. Power Dissipation Per Package 8-pin µSOIC (derate 4.85mWoC above +70oC)...................390mW The information furnished herein by Sipex has been carefully reviewed for accuracy and reliability. Its application or use, however, is solely the responsibility of the user. No responsibility for the use of this information is assumed by Sipex, and this information shall not explicitly or implicitly become part of the terms and conditions of any subsequent sales agreement with Sipex. Specifications are subject to change without prior notice. By the sale or transfer of this information, Sipex assumes no responsibility for any infringement of patents or other rights of third parties which may result from its use. No license or other proprietary rights are granted by implication or otherwise under any patent or patent rights of Sipex Corporation. This data sheet specifies environmental parameters, final test conditions and limits as well suggested operating conditions. For applications which require performance beyond the specified condition and or limits please consult the factory. Bonding Diagram: PAD X Y 261.0 427.0 EL1 813.0 429.0 EL2 813.0 28.0 D1 813.0 -172.0 COIL 767.0 -381.0 143.5 -412.0 -790.0 -157.5 HON -785.5 402.0 R E T E M A R A P. N I M. P Y T. X A MS T I N US N O I T I D N O C V , e g a t l o V y l p p u S D D 2 . 20 . 33 . 3V , t n e r r u C y l p p u SI L I O C I + D D 8 20 4A mV N O H V = D D V 3 = V , e g a t l o V li o C L I O C V D D 3 . 3 V V , e g a t l o V t u p n I N O H N O H f f o L E : W O L n o L E : H G I H 5 2 . 0 - V D D 5 2 . 0 - 0 V D D V 5 2 . 0 V D D 5 2 . 0 + V n o L E , t n e r r u C N O H5 0 2 Α µ V , n w o d ll u p l a n r e t n i N O H V = D D V 3 = I , t n e r r u C n w o d t u h S D S I = L I O C I + D D 1 . 00 . 1 µA V N O H V 0 = E V I R D R O T C U D N I f , y c n e u q e r F li o C L I O C f = P M A L 4 6 x8 . 8 2z H k e l c y C y t u D li o C0 9% I , t n e r r u C li o C k a e P L I O C - K P 0 9A m. n g i s e d y b d e e t n a r a u G T U P T U O P M A L L E f , y c n e u q e r F p m a L L E P M A L 0 0 3 5 2 2 0 5 40 0 5 5 7 7 z H T B M A 5 2 + = O V , C D D V 0 . 3 = T B M A 0 4 - = O 5 8 + o t C O V , C D D V 0 . 3 = e g a t l o V t u p t u O k a e P o t k a e P 0 9 0 4 1 0 9 0 2 1 0 6 1V P P T B M A 5 2 + = O V , C D D V 2 . 2 = T B M A 5 2 + = O V , C D D V 0 . 3 = T B M A 0 4 - = O 5 8 + o t C O V , C D D V 0 . 3 = V DD V SS C OSC |
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