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TPPM0110DWP Datasheet(PDF) 9 Page - Texas Instruments |
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TPPM0110DWP Datasheet(HTML) 9 Page - Texas Instruments |
9 / 14 page TPPM0110 DUAL LOW-DROPOUT LINEAR REGULATOR SLVS365 –MARCH 2001 9 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TYPICAL THERMAL CHARACTERISTICS To ensure reliable operation of the device, the junction temperature of the output device must be within the safe operating area (SOA). This is achieved by providing a means to dissipate the heat generated from the junction of the output structure. There are two components that contribute to thermal resistance. They consist of two paths in series. The first is the junction-to-case thermal resistance, RθJC; the second is the case-to-ambient thermal resistance, RθCA. The overall junction-to-ambient thermal resistance, RθJA, is determined by: RθJA = RθJC + RθCA The ability to efficiently dissipate the heat from the junction is a function of the package style and board layout incorporated in the application. The operating junction temperature is determined by the operating ambient temperature, TA, and the junction power dissipation, PJ. The junction temperature, TJ, is determined by the following thermal equation: TJ = TA + PJ (RθJC) + PJ (RθCA) TJ = TA + PJ (RθJA) This particular application uses the 20-pin DWP power pad package with a standard lead frame with a dedicated ground terminal. Using a multilayer printed-circuit board (PCB), the power pad is mounted as recommended in the TI packaging application. The power pad is electrically connected to the ground plane of the board through a dedicated ground pin and the die mount power pad. This provides a means for heat spreading through the copper plane associated within the PCB (ground layer). The thermal resistance from junction to ambient, RθJA, is dependent of several factors, the implemented method of package attachment to the heat spreading material and the air flow in the system application. |
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