TM4100GAD8

4194304 BY 8-BIT DRAM MODULE

SMMS508C – MARCH 1992 – REVISED JUNE 1995

2

POST OFFICE BOX 1443

single in-line memory module and components

PC substrate: 1,27 mm (0.05 inch) nominal thickness; 0.005 inch/inch maximum warpage

Bypass capacitors: Multilayer ceramic

Contact area for socketable devices: Nickel plate and solder plate over copper

functional block diagram

A0-A10

RAS

CAS

W

DQ2

Q

4096

× 1

4096

× 1

Q

DQ1

W

CAS

RAS

A0 – A10

W

CAS

RAS

A0 – A10

RAS

CAS

W

DQ3

Q

4096

× 1

DQ3

A0 – A10

RAS

CAS

W

DQ4

Q

4096

× 1

DQ2

DQ1

DQ4

A0 – A10

A0 – A10

RAS

CAS

W

DQ6

Q

4096

× 1

4096

× 1

Q

DQ5

CAS

RAS

A0 – A10

A0 – A10

RAS

CAS

W

DQ7

Q

4096

× 1

DQ7

A0 – A10

RAS

CAS

W

DQ8

Q

4096

× 1

DQ6

DQ5

DQ8

11

VCC

VSS

VCC

VSS

VCC

VSS

VCC

VSS

VCC

VSS

VCC

VSS

VCC

VSS

VCC

VSS

VCC

VSS

C . . . .C

W

11

11

11

11

11

11

11