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HFBR-53D5FM Datasheet(PDF) 5 Page - Agilent(Hewlett-Packard) |
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HFBR-53D5FM Datasheet(HTML) 5 Page - Agilent(Hewlett-Packard) |
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5 / 16 page  5 intrinsically eye safe and does not require shut down circuitry. Signal Detect The Signal Detect circuit provides a deasserted output signal that implies the link is open or the transmitter is OFF as defined by the Gigabit Ethernet specification IEEE 802.3z, Table 38.1. The Signal Detect threshold is set to transition from a high to low state between the minimum receiver input optional power and –30 dBm avg. input optical power indicating a definite optical fault (e.g. unplugged connector for the receiver or transmitter, broken fiber, or failed far-end transmitter or data source). A Signal Detect indicating a working link is functional when receiving encoded 8B/10B characters. The Signal Detect does not detect receiver data error or error-rate. Data errors are determined by Signal processing following the transceiver. Electromagnetic Interference (EMI) One of a circuit board designer’s foremost concerns is the control of electromagnetic emissions from electronic equipment. Success in controlling generated Electromagnetic Interference (EMI) enables the designer to pass a governmental agency’s EMI regulatory standard; and more importantly, it reduces the possibility of interference to neighboring equipment. There are three options available for the HFBR-53D5 and two options for the HFCT-53D5 with regard to EMI shielding which provide the designer with a means to achieve good EMI performance. The EMI performance of an enclosure using these transceivers is dependent on the chassis design. Agilent encourages using standard RF suppression practices and avoiding poorly EMI-sealed enclosures. The first configuration is a standard HFBR-53D5 fiber-optic transceiver that has no external EMI shield. This unit is for applications where EMI is either not an issue for the designer, or the unit resides completely inside a shielded enclosure, or the module is used in low density, extremely quiet applications. The HFCT-53D5 is not available for use without an external shield. The second configuration, option EM, is for EMI shielding applications where the position of the transceiver module will extend outside the equipment enclosure. The metallized plastic package and integral external metal shield of the transceiver helps locally to terminate EM fields to the chassis to prevent their emissions outside the enclosure. This metal shield contacts the panel or enclosure on the inside of the aperture on all but the bottom side of the shield and provides a good RF connection to the panel. This option can accommodate various panel or enclosure thickness, i.e., .04 in. min. to 0.10 in. max. The reference plane for this panel thickness variation is from the front surface of the panel or enclosure. The recommended length for protruding the HFBR/HFCT-53D5EM transceiver beyond the front surface of the panel or enclosure is 0.25 in. With this option, there is flexibility of positioning the module to fit the specific need of the enclosure design. (See Figure 6 for the mechanical drawing dimensions of this shield.) The third configuration, option FM, is for applications that are designed to have a flush mounting of the module with respect to the front of the panel or enclosure. The flush-mount design accommodates a large variety of panel thickness, i.e., 0.04 in. min. to 0.10 in. max. Note the reference plane for the flush-mount design is the interior side of the panel or enclosure. The recommended distance from the centerline of the transceiver front solder posts to the inside wall of the panel is 0.55 in. This option contacts the inside panel or enclosure wall on all four sides of this metal shield. See Figure 8 for the mechanical drawing dimensions of this shield. The two metallized designs are comparable in their shielding effectiveness. Both design options connect only to the equipment chassis and not to the signal or logic ground of the circuit board within the equipment closure. The front panel aperture dimensions are recommended in Figures 7 and 9. When layout of the printed circuit board is done to incorporate these metal-shielded transceivers, keep the area on the printed circuit board directly under the metal shield free of any components and circuit board traces. For additional EMI performance advantage, use duplex SC fiber-optic connectors that have low metal content inside them. This lowers the ability of the metal fiber-optic connectors to couple EMI out through the aperture of the panel or enclosure. Evaluation Kit To help you in your preliminary transceiver evaluation, Agilent offers a 1250 MBd Gigabit |
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