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TGA2925-SG Datasheet(PDF) 3 Page - TriQuint Semiconductor |
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TGA2925-SG Datasheet(HTML) 3 Page - TriQuint Semiconductor |
3 / 10 page Advance Product Information Aug 16, 2005 3 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com TABLE III THERMAL INFORMATION Parameter Test Conditions TCH ( oC) RTJC ( qC/W) TM (HRS) RθJC Thermal Resistance (channel to backside of package) Vd = 8 V ID = 0.75 A Pdiss = 6 W 143 12.2 1.2E+9 Note: Package backside SnPb soldered to carrier at 70 °C baseplate temperature. At saturated output power, the DC power consumption is 13.2W with 5.6W RF power delivered to the load and 7.6W dissipated. TABLE II RF CHARACTERIZATION TABLE (TA = 25 qC, Nominal) (Vd = 8 V, Idq = 0.75 A) SYMBOL PARAMETER TEST CONDITION TYPICAL UNITS Gain Small Signal Gain f = 3.5 GHz 11 dB IRL Input Return Loss f = 3.5 GHz 10 dB ORL Output Return Loss f = 3.5 GHz 8 dB Psat Saturated Output Power 37.5 dBm TGA2925-SG |
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