MCP4922T-EP datasheet(20/40 Pages) MICROCHIP

Part #	MCP4922T-EP

Description	12-Bit DAC with SPI??Interface

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Manufacturer	MICROCHIP [Microchip Technology]

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MCP4921/4922

DS21897A-page 20

 2004 Microchip Technology Inc.

6.0

TYPICAL APPLICATIONS

The MCP492X devices are general purpose DACs

intended to be used in applications where a precision,

low-power DAC with moderate bandwidth is required.

Applications generally suited for the MCP492X devices

include:

• Set Point or Offset Trimming

• Sensor Calibration

• Digitally-Controlled Multiplier/Divider

• Portable Instrumentation (Battery Powered)

• Motor Feedback Loop Control

6.1

Digital Interface

The MCP492X utilizes a 3-wire syncronous serial

protocol to transfer the DACs’ setup and output values

from the digital source. The serial protocol can be inter-

faced to SPI™ or Microwire peripherals common on

many

microcontrollers,

including

Microchip’s

PICmicro® MCUs & dsPICTM DSC family of microcon-

trollers. In addition to the three serial connections (CS,

SCK and SDI), the LDAC signal syncronizes when the

serial settings are latched into the DAC’s output from

the serial input latch. Figure 6-1 illustrates the required

connections. Note that LDAC is active-low. If desired,

this input can be tied low to reduce the required con-

nections from 4 to 3. Write commands will be latched

directly into the output latch when a valid 16 clock

transmission has been received and CS has been

raised.

6.2

Power Supply Considerations

The typical application will require a by-pass capacitor

in order to filter high-frequency noise. The noise can

be induced onto the power supply's traces or as a result

of changes on the DAC's output. The bypass capacitor

helps to minimize the effect of these noise sources on

signal integrity. Figure 6-1 illustrates an appropriate

bypass strategy.

In this example, the recommended bypass capacitor

value is 0.1 µF. This capacitor should be placed as

close to the device power pin (VDD) as possible (within

4mm).

The power source supplying these devices should be

as clean as possible. If the application circuit has sep-

arate digital and analog power supplies, AVDD and

AVSS should reside on the analog plane.

FIGURE 6-1:

Typical Connection

Diagram.

6.3

Layout Considerations

Inductively-coupled AC transients and digital switching

noise can degrade the input and output signal integrity,

potentially masking the MCP492X’s performance.

Careful board layout will minimize these effects and

increase the signal-to-noise ratio (SNR). Bench testing

has shown that a multi-layer board utilizing a low-induc-

tance ground plane, isolated inputs, isolated outputs

and proper decoupling are critical to achieving the

performance that the silicon is capable of providing.

Particularly harsh environments may require shielding

of critical signals.

Breadboards

and

wire-wrapped

boards

are

not

recommended if low noise is desired.

Note:

At the time of this data sheet’s release,

circuit

examples

had

not

completed

testing. Your results may vary.

VDD

AVSS

VREFA

VOUTA

VREFB

VOUTB

0.1 µF

0.1 µF 0.1 µF

VREFA

VOUTA

VREFB

VOUTB

SDI

CS1

SDO

SCK

LDAC

CS0

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