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CM1452-06CP Datasheet(PDF) 5 Page - California Micro Devices Corp |
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CM1452-06CP Datasheet(HTML) 5 Page - California Micro Devices Corp |
5 / 6 page PRELIMINARY © 2005 California Micro Devices Corp. All rights reserved. 6/23/05 430 N. McCarthy Blvd., Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 5 PRINTED CIRCUIT BOARD RECOMMENDATIONS Pad size in PCB 0.240mm Pad Shape Round Pad Definition Non Solder Mask Defined Pads Solder Mask Opening 0.290mm Round Solder Stencil Thickness 0.150mm Solder Stencil Aperture Opening (Laser cut, 5% tapered walls) 0.300mm (round) Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Bond Trace Finish OSP (Entek Cu Plus 106A) Tolerance – Edge to Corner Ball 50µm Solder Ball Side Coplanarity 20µm Soldering Minimum Temperature 205’C for at least 30 seconds Maximum Dwell Time above Liquidous (183°C) 60 seconds Soldering Maximum Temperature 260’C for at less than 2 minutes |
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