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HT7327 Datasheet(PDF) 10 Page - Holtek Semiconductor Inc |
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HT7327 Datasheet(HTML) 10 Page - Holtek Semiconductor Inc |
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10 / 12 page  TO-92 Carrier Tape Dimensions TO-92 Symbol Description Dimensions in mm I1 Taped Lead Length (2.5) P Component Pitch 12.7 ±1.0 P0 Perforation Pitch 12.7 ±0.3 P2 Component to Perforation (Length Direction) 6.35 ±0.4 F1 Lead Spread 2.5+0.4 -0.1 F2 Lead Spread 2.5+0.4 -0.1 Dh Component Alignment 0 ±0.1 W Carrier Tape Width 18.0+1.0 -0.5 W0 Hold-down Tape Width 6.0 ±0.5 W1 Perforation Position 9.0 ±0.5 W2 Hold-down Tape Position (0.5) H0 Lead Clinch Height 16.0 ±0.5 H1 Component Height Less than 24.7 D0 Perforation Diameter 4.0 ±0.2 t Taped Lead Thickness 0.7 ±0.2 H Component Base Height 19.0 ±0.5 Note: Thickness less than 0.38 ±0.05mm~0.5mm P0 Accumulated pitch tolerance: ±1mm/20pitches. ( ) Bracketed figures are for consultation only HT73XX Rev. 1.40 10 January 12, 2006 F 1 F 2 P 2 P 0 D 0 W 2 W 0 W W 1 P H 0 H H 1 t D h l 1 |
Similar Part No. - HT7327 |
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Similar Description - HT7327 |
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