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EMM5834X Datasheet(PDF) 11 Page - Eudyna Devices Inc |
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EMM5834X Datasheet(HTML) 11 Page - Eudyna Devices Inc |
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11 / 14 page  11 ■ ■ ■ ■ Chip Outline and Bonding Pad Locations (Dimension in Micro-Meters) Chip Size : 2880± ± ± ± 30um x 1380± ± ± ± 30um Chip Thickness : 60± ± ± ± 20um Bonding Pad Size : 80um x 80um(VDD, VGG), 160um x 80um (RF) RF-OUT 0 0 1380 2880 0 1380 0 2880 VDD1 VGG1 RF-IN VDD2 VDD3 VDD4 VGG2 VGG3 VGG4 105 2770 1075 230 110 1075 930 2160 2770 110 105 1220 310 1135 1265 2250 1220 Ku / K-Band Power Amplifier MMIC EMM5834X |
Similar Part No. - EMM5834X |
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Similar Description - EMM5834X |
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