MECHANICAL DATA

MPQF114B – MAY 2002

1

POST OFFICE BOX 655303

RGY (S–PQFP–N14)

PLASTIC QUAD FLATPACK

2,00

3,65

3,35

2,15 Max

1,50

14

13

1

0,50

2

C

0,08

1,00

0,80

2,15 Max

14X

9

8

6

7

0,30

0,50

Seating Plane

Seating Height

0,00

0,05

0,20 Nominal

Lead Frame

C

3,35

3,65

B

Pin 1 Index Area

14X 0,23–0,05

+0,07

0,10

0,05 M C

M C A B

D

Exposed Thermal Die Pad

Top and Bottom

Pin 1 Identifier

Bottom View

4203539–2/D 05/2002

A

NOTES: A.

All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. QFN (Quad Flatpack No–Lead) Package configuration.

D. The Package thermal performance may be enhanced by bonding the thermal die pad to an external thermal plane. This pad is

electrically and thermally connected to the backside of the die and possibly selected ground leads.