Electronic Components Datasheet Search |
|
194D225X0004A2T Datasheet(PDF) 8 Page - Vishay Siliconix |
|
194D225X0004A2T Datasheet(HTML) 8 Page - Vishay Siliconix |
8 / 9 page www.vishay.com 131 194D Vishay Sprague Document Number 40000 Revision 05-Jul-02 For technical questions, contact tantalum@vishay.com in inches [millimeters] * Pads for B, C and D case codes are otherwise pad compatible with Type 293D, B, C and D case codes respectively. REFLOW SOLDER PADS* A B B C PAD CASE WIDTH METALLIZATION SEPARATION CODE (A) (B) (C) A 0.065 0.050 0.040 [1.6] [1.3] [1.0] B 0.065 0.070 0.055 [1.6] [1.8] [1.4] C 0.066 0.070 0.120 [1.6] [1.8] [3.0] D 0.115 0.070 0.070 [2.9] [1.8] [1.8] E 0.115 0.070 0.120 [2.8] [1.8] [3.6] F 0.150 0.070 0.140 [3.8] [1.8] [3.6] G 0.125 0.070 0.170 [3.2] [1.8] [4.3] H 0.165 0.080 0.170 [4.2] [2.3] [4.3] GUIDE TO APPLICATION (Continued) 5. Power Dissipation: Power dissipation will be affected by the heat sinking capability of the mounting surface. Non-sinusoidal ripple current may produce heating effects which differ from those shown. It is important that the equivalent Irms value be established when calculating permissible operating levels. (Power dissipation calculated using + 25 °C temperature rise.) 6. Printed Circuit Board Materials: The 194D is compatible with most commonly used printed circuit board materials (alumina substrates, FR4, FR5, G10, PTFE-fluorocarbon and porcelanized steel). If your desired board material is not shown there, please contact the Tantalum Marketing Department for assistance in determining compatibility. 7. Attachment: 7.1 Solder Paste: The recommended thickness of the solder paste after application is .007" ± .001" [1.78mm ± .025mm]. Care should be exercised in selecting the solder paste. The metal purity should be as high as practical. The flux (in the paste) must be active enough to remove the oxides formed on the metallization prior to the exposure to soldering heat. In practice this can be aided by extending the solder preheat time at temperatures below the liquidious state of the solder. 7.2 Soldering: Capacitors can be attached by conventional soldering techniques - convection, infrared reflow, wave soldering and hot plate methods. The Solder Temperature/Soldering Time chart shows maximum recommended time/ temperature conditions for soldering. Attachment with a soldering iron is not recommended due to the difficulty of controlling time at temperature. 8. Cleaning (Flux Removal) After Soldering: The 695D is compatible with all commonly used solvents such as TES, TMS, Prelete, Chlorethane. Solvents containing methylene chloride or other epoxy solvents should be avoided since these will attack the epoxy encapsulation material. 9. Recommended Mounting Pad Geometries: The area under the tantalum wire nib should not be metalized on the PC board. The nib must have sufficient clearance to avoid electrical contact with other components. The width dimension indicated is the same as the maximum width of the capacitor.This is to minimize lateral movement. Temperature + 25 °C + 55 °C + 85 °C + 125 °C Derating Factor 1.0 0.9 0.8 0.4 A B C D E F G H Maximum Permissible Power Dissipation @ + 25 °C (Watts) in free air Case Code 0.060 0.075 0.075 0.085 0.095 0.110 0.120 0.150 |
Similar Part No. - 194D225X0004A2T |
|
Similar Description - 194D225X0004A2T |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |