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131

194D

Vishay Sprague

Document Number 40000

Revision 05-Jul-02

For technical questions, contact tantalum@vishay.com

in inches [millimeters]

* Pads for B, C and D case codes are otherwise pad compatible with

Type 293D, B, C and D case codes respectively.

REFLOW SOLDER PADS*

A

B

B

C

PAD

CASE

WIDTH

METALLIZATION

SEPARATION

CODE

(A)

(B)

(C)

A

0.065

0.050

0.040

[1.6]

[1.3]

[1.0]

B

0.065

0.070

0.055

[1.6]

[1.8]

[1.4]

C

0.066

0.070

0.120

[1.6]

[1.8]

[3.0]

D

0.115

0.070

0.070

[2.9]

[1.8]

[1.8]

E

0.115

0.070

0.120

[2.8]

[1.8]

[3.6]

F

0.150

0.070

0.140

[3.8]

[1.8]

[3.6]

G

0.125

0.070

0.170

[3.2]

[1.8]

[4.3]

H

0.165

0.080

0.170

[4.2]

[2.3]

[4.3]

GUIDE TO APPLICATION (Continued)

5.

Power Dissipation: Power dissipation will be

affected by the heat sinking capability of the mounting

surface. Non-sinusoidal ripple current may produce

heating effects which differ from those shown. It is

important that the equivalent

established when calculating permissible operating

levels. (Power dissipation calculated using + 25

°C

temperature rise.)

6.

Printed Circuit Board Materials: The 194D is

compatible with most commonly used printed circuit

board materials (alumina substrates, FR4, FR5, G10,

PTFE-fluorocarbon and porcelanized steel). If your

desired board material is not shown there, please

contact the Tantalum Marketing Department for

assistance in determining compatibility.

7.

Attachment:

7.1

Solder Paste: The recommended thickness of the

solder paste after application is .007"

± .001"

[1.78mm

± .025mm]. Care should be exercised in

selecting the solder paste. The metal purity should

be as high as practical. The flux (in the paste) must

be active enough to remove the oxides formed on

the metallization prior to the exposure to soldering

heat. In practice this can be aided by extending the

solder preheat time at temperatures below the

liquidious state of the solder.

7.2

Soldering: Capacitors can be attached by

conventional soldering techniques - convection,

infrared reflow, wave soldering and hot plate

methods. The Solder Temperature/Soldering Time

chart shows maximum recommended time/

temperature conditions for soldering. Attachment

with a soldering iron is not recommended due to the

difficulty of controlling time at temperature.

8.

Cleaning (Flux Removal) After Soldering: The

695D is compatible with all commonly used solvents

such as TES, TMS, Prelete, Chlorethane.

Solvents containing methylene chloride or other

epoxy solvents should be avoided since these will

attack the epoxy encapsulation material.

9.

Recommended Mounting Pad Geometries: The area

under the tantalum wire nib should not be metalized on

the PC board. The nib must have sufficient clearance to

avoid electrical contact with other components. The

width dimension indicated is the same as the maximum

width of the capacitor.This is to minimize lateral

movement.

Temperature

+ 25

°C

+ 55

°C

+ 85

°C

+ 125

°C

Derating

Factor

1.0

0.9

0.8

0.4

A

B

C

D

E

F

G

H

Maximum Permissible

Power Dissipation

@ + 25

in free air

Case

Code

0.060

0.075

0.075

0.085

0.095

0.110

0.120

0.150