Copyright  ANPEC Electronics Corp.

Rev. B.1 - Apr., 2003

APL5833

www.anpec.com.tw

9

t 25 C to P e ak

tp

Ram p-u p

t

L

Ram p-d ow n

ts

P rehea t

Tsm ax

Tsm in

T

L

T

P

25

Tim e

C ritical Z one

T

L

to T

P

°

Physical Specifications

Terminal Material

Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn

Lead Solderability

Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.

Classificatin Reflow Profiles

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Profile Feature

Large Body

Small Body

Large Body

Small Body

Average ramp-up rate

3

°C/second max.

3

°C/second max.

Preheat

- Temperature Min (Tsmin)

- Temperature Mix (Tsmax)

- Time (min to max)(ts)

100

°C

150

°C

60-120 seconds

150

°C

200

°C

60-180 seconds

- Ramp-up Rate

3

°C/second max

183

°C

60-150 seconds

217

°C

60-150 seconds

Peak Temperature(Tp)

225 +0/-5

°C

240 +0/-5

°C

245 +0/-5

°C

250 +0/-5

°C

Time within 5

°C of actual Peak

Temperature(tp)

10-30 seconds

10-30 seconds

10-30 seconds

20-40 seconds

Ramp-down Rate

6

°C/second max.

6

°C/second max.

Time 25

°C to Peak Temperature

6 minutes max.

8 minutes max.

Note: All temperatures refer to topside of the package. Measured on the body surface.