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IRS21365D Datasheet(PDF) 2 Page - International Rectifier |
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IRS21365D Datasheet(HTML) 2 Page - International Rectifier |
2 / 23 page www.irf.com 2 IRS213(6,62,63,65,66,67,68)D(J&S)PbF Absolute Maximum Ratings Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Recommended Operating Conditions The input/output logic-timing diagram is shown in Fig. 1. For proper operation the device should be used within the recommended conditions. All voltage parameters are absolute referenced to COM. The VS & VSS offset ratings are tested with all supplies biased at a 15 V differential. Symbol Definition Min. Max. Units IRS213(6,68)D VS1,2,3 +10 VS1,2,3 + 20 IRS21362D VS1,2,3 +11.5 VS1,2,3 + 20 VB1,2,3 High side floating supply voltage IRS213(6,63,65,66,67)D VS1,2,3 +12 VS1,2,3 + 20 VS 1,2,3 High side floating supply voltage Note 1 600 IRS213(6,68)D 10 20 IRS21362D 11.5 20 VCC Low side supply voltage IRS213(6,63,65,66,67)D 12 20 VHO 1,2,3 High side output voltage VS1,2,3 VB1,2,3 VLO1,2,3 Low side output voltage 0 VCC VSS Logic ground -5 5 VFLT FAULT output voltage VSS VCC VRCIN RCIN input voltage VSS VCC V Note 1: Logic operational for VS of (COM - 8 V) to (COM + 600 V). Logic state held for VS of (COM - 8 V) to (COM – VBS). (Please refer to the Design Tip DT97-3 for more details). Symbol Definition Min. Max. Units VS High side offset voltage VB 1,2,3 - 20 VB 1,2,3 + 0.3 VB High side floating supply voltage -0.3 620 VHO1,2,3 High side floating output voltage VS1,2,3 - 0.3 VB 1,2,3 + 0.3 VCC Low side and logic fixed supply voltage -0.3 20 VSS Logic ground VCC - 20 VCC + 0.3 VLO1,2,3 Low side output voltage -0.3 VCC + 0.3 VIN Input voltage LIN, HIN, ITRIP, EN, RCIN VSS -0.3 VCC + 0.3 VFLT FAULT output voltage VSS -0.3 VCC + 0.3 V dV/dt Allowable offset voltage slew rate — 50 V/ns (28 lead PDIP) — 1.5 (28 lead SOIC) — 1.6 PD Package power dissipation @ TA ≤ +25 °C (44 lead PLCC) — 2.0 W (28 lead PDIP) — 83 (28 lead SOIC) — 78 RthJA Thermal resistance, junction to ambient (44 lead PLCC) — 63 °C/W TJ Junction temperature — 150 TS Storage temperature -55 150 TL Lead temperature (soldering, 10 seconds) — 300 °C PRELIMINARY |
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